JPS6455831A - Die bonder - Google Patents

Die bonder

Info

Publication number
JPS6455831A
JPS6455831A JP62212530A JP21253087A JPS6455831A JP S6455831 A JPS6455831 A JP S6455831A JP 62212530 A JP62212530 A JP 62212530A JP 21253087 A JP21253087 A JP 21253087A JP S6455831 A JPS6455831 A JP S6455831A
Authority
JP
Japan
Prior art keywords
covers
opening
atmospheric
cover
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62212530A
Other languages
Japanese (ja)
Inventor
Hiroshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62212530A priority Critical patent/JPS6455831A/en
Publication of JPS6455831A publication Critical patent/JPS6455831A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To effectively hold atmospheric gas in a recess and to prevent a soldering performance from decreasing by movably adjusting independently atmospheric covers in two-dimensional directions along a cover face, and altering the position of a cutout opening and an opening area by the moving operation of the cover. CONSTITUTION:Atmospheric covers 10a, 10b are movably adjusted independently in two-dimensional directions along a cover lace by X-Y table units 13a, 13b. L-shaped cutouts 14a, 14b are formed at the superposing positions of the covers 10a, 10b, and superposed to form a rectangular cutout opening 15 which becomes to inset a semiconductor element. Thus, when a semiconductor element 6 is bonded to a semiconductor substrate 1 charged into a recess 2, the covers 10a, 10b are moved in X-Y directions to arbitrarily alter the position of the opening 15 and the opening area in response to the insertion of the element 6, and so set as to be optimum in response to the mounting conditions of the element on the substrate.
JP62212530A 1987-08-26 1987-08-26 Die bonder Pending JPS6455831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62212530A JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62212530A JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Publications (1)

Publication Number Publication Date
JPS6455831A true JPS6455831A (en) 1989-03-02

Family

ID=16624199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62212530A Pending JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Country Status (1)

Country Link
JP (1) JPS6455831A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153783A (en) * 1993-11-30 1995-06-16 Nec Corp Semiconductor manufacturing equipment
WO2004064138A1 (en) * 2003-01-08 2004-07-29 Fujitsu Limited Die bonding device
CN110510184A (en) * 2019-09-27 2019-11-29 京东方科技集团股份有限公司 Positioning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153783A (en) * 1993-11-30 1995-06-16 Nec Corp Semiconductor manufacturing equipment
WO2004064138A1 (en) * 2003-01-08 2004-07-29 Fujitsu Limited Die bonding device
CN110510184A (en) * 2019-09-27 2019-11-29 京东方科技集团股份有限公司 Positioning device
CN110510184B (en) * 2019-09-27 2021-08-03 高创(苏州)电子有限公司 Positioning device

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