JPS6455831A - Die bonder - Google Patents
Die bonderInfo
- Publication number
- JPS6455831A JPS6455831A JP62212530A JP21253087A JPS6455831A JP S6455831 A JPS6455831 A JP S6455831A JP 62212530 A JP62212530 A JP 62212530A JP 21253087 A JP21253087 A JP 21253087A JP S6455831 A JPS6455831 A JP S6455831A
- Authority
- JP
- Japan
- Prior art keywords
- covers
- opening
- atmospheric
- cover
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To effectively hold atmospheric gas in a recess and to prevent a soldering performance from decreasing by movably adjusting independently atmospheric covers in two-dimensional directions along a cover face, and altering the position of a cutout opening and an opening area by the moving operation of the cover. CONSTITUTION:Atmospheric covers 10a, 10b are movably adjusted independently in two-dimensional directions along a cover lace by X-Y table units 13a, 13b. L-shaped cutouts 14a, 14b are formed at the superposing positions of the covers 10a, 10b, and superposed to form a rectangular cutout opening 15 which becomes to inset a semiconductor element. Thus, when a semiconductor element 6 is bonded to a semiconductor substrate 1 charged into a recess 2, the covers 10a, 10b are moved in X-Y directions to arbitrarily alter the position of the opening 15 and the opening area in response to the insertion of the element 6, and so set as to be optimum in response to the mounting conditions of the element on the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62212530A JPS6455831A (en) | 1987-08-26 | 1987-08-26 | Die bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62212530A JPS6455831A (en) | 1987-08-26 | 1987-08-26 | Die bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6455831A true JPS6455831A (en) | 1989-03-02 |
Family
ID=16624199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62212530A Pending JPS6455831A (en) | 1987-08-26 | 1987-08-26 | Die bonder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6455831A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07153783A (en) * | 1993-11-30 | 1995-06-16 | Nec Corp | Semiconductor manufacturing equipment |
WO2004064138A1 (en) * | 2003-01-08 | 2004-07-29 | Fujitsu Limited | Die bonding device |
CN110510184A (en) * | 2019-09-27 | 2019-11-29 | 京东方科技集团股份有限公司 | Positioning device |
-
1987
- 1987-08-26 JP JP62212530A patent/JPS6455831A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07153783A (en) * | 1993-11-30 | 1995-06-16 | Nec Corp | Semiconductor manufacturing equipment |
WO2004064138A1 (en) * | 2003-01-08 | 2004-07-29 | Fujitsu Limited | Die bonding device |
CN110510184A (en) * | 2019-09-27 | 2019-11-29 | 京东方科技集团股份有限公司 | Positioning device |
CN110510184B (en) * | 2019-09-27 | 2021-08-03 | 高创(苏州)电子有限公司 | Positioning device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY109082A (en) | Pad array semiconductor device with thermal conductor and process for making the same | |
EP0473796A4 (en) | Semiconductor device having a plurality of chips | |
GB1043942A (en) | Method for connecting semiconductor devices | |
MY108561A (en) | Electrode for semiconductor element and semiconductor device having the electrode and process for producing the same. | |
JPS6455831A (en) | Die bonder | |
JPS53100765A (en) | Production of semiconductor device | |
EP0081419A3 (en) | High lead count hermetic mass bond integrated circuit carrier | |
JPS5615065A (en) | Semiconductor integrated circuit | |
JPS6449246A (en) | Semiconductor device | |
JPS53128283A (en) | Semiconductor device | |
JPS56148840A (en) | Mounting structure for ic | |
WO2002041679A3 (en) | Electromagnetic shielding and cooling device for printed circuit board | |
JPS53110371A (en) | Ceramic package type semiconductor device | |
JPS5322373A (en) | Solder d isc feeder to wafers | |
JPS5618450A (en) | Semiconductor element assembling structure | |
JPS5353254A (en) | Semiconductor device | |
JPS5374367A (en) | Semiconductor device | |
JPS542069A (en) | Semiconductor device | |
JPS5336467A (en) | Semiconductor pellet fixture to metal substrate | |
JPS53119676A (en) | Semiconductor device | |
JPS5745250A (en) | Manufacture of semiconductor device | |
JPS5610952A (en) | Hybrid integrated circuit substrate | |
JPS5399782A (en) | Semiconductor integrated circuit device and its manufacture | |
JPS5318987A (en) | Semiconductor device | |
JPH04256328A (en) | Bonding tool for olb device |