JPS6455831A - Die bonder - Google Patents

Die bonder

Info

Publication number
JPS6455831A
JPS6455831A JP62212530A JP21253087A JPS6455831A JP S6455831 A JPS6455831 A JP S6455831A JP 62212530 A JP62212530 A JP 62212530A JP 21253087 A JP21253087 A JP 21253087A JP S6455831 A JPS6455831 A JP S6455831A
Authority
JP
Japan
Prior art keywords
covers
opening
atmospheric
cover
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62212530A
Other languages
English (en)
Inventor
Hiroshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62212530A priority Critical patent/JPS6455831A/ja
Publication of JPS6455831A publication Critical patent/JPS6455831A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62212530A 1987-08-26 1987-08-26 Die bonder Pending JPS6455831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62212530A JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62212530A JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Publications (1)

Publication Number Publication Date
JPS6455831A true JPS6455831A (en) 1989-03-02

Family

ID=16624199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62212530A Pending JPS6455831A (en) 1987-08-26 1987-08-26 Die bonder

Country Status (1)

Country Link
JP (1) JPS6455831A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153783A (ja) * 1993-11-30 1995-06-16 Nec Corp 半導体製造装置
WO2004064138A1 (ja) * 2003-01-08 2004-07-29 Fujitsu Limited ダイボンディング装置
CN110510184A (zh) * 2019-09-27 2019-11-29 京东方科技集团股份有限公司 定位装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153783A (ja) * 1993-11-30 1995-06-16 Nec Corp 半導体製造装置
WO2004064138A1 (ja) * 2003-01-08 2004-07-29 Fujitsu Limited ダイボンディング装置
CN110510184A (zh) * 2019-09-27 2019-11-29 京东方科技集团股份有限公司 定位装置
CN110510184B (zh) * 2019-09-27 2021-08-03 高创(苏州)电子有限公司 定位装置

Similar Documents

Publication Publication Date Title
MY109082A (en) Pad array semiconductor device with thermal conductor and process for making the same
EP0473796A4 (en) Semiconductor device having a plurality of chips
GB1043942A (en) Method for connecting semiconductor devices
MY108561A (en) Electrode for semiconductor element and semiconductor device having the electrode and process for producing the same.
JPS6455831A (en) Die bonder
JPS53100765A (en) Production of semiconductor device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS5615065A (en) Semiconductor integrated circuit
JPS6449246A (en) Semiconductor device
JPS53128283A (en) Semiconductor device
JPS56148840A (en) Mounting structure for ic
WO2002041679A3 (en) Electromagnetic shielding and cooling device for printed circuit board
JPS53110371A (en) Ceramic package type semiconductor device
JPS5322373A (en) Solder d isc feeder to wafers
JPS5618450A (en) Semiconductor element assembling structure
JPS5353254A (en) Semiconductor device
JPS5374367A (en) Semiconductor device
JPS542069A (en) Semiconductor device
JPS5336467A (en) Semiconductor pellet fixture to metal substrate
JPS53119676A (en) Semiconductor device
JPS5745250A (en) Manufacture of semiconductor device
JPS5610952A (en) Hybrid integrated circuit substrate
JPS5399782A (en) Semiconductor integrated circuit device and its manufacture
JPS5318987A (en) Semiconductor device
JPH04256328A (ja) Ｏｌｂ装置のボンディングツール