WO2002041679A3 - Electromagnetic shielding and cooling device for printed circuit board - Google Patents

Electromagnetic shielding and cooling device for printed circuit board Download PDF

Info

Publication number
WO2002041679A3
WO2002041679A3 PCT/US2001/046122 US0146122W WO0241679A3 WO 2002041679 A3 WO2002041679 A3 WO 2002041679A3 US 0146122 W US0146122 W US 0146122W WO 0241679 A3 WO0241679 A3 WO 0241679A3
Authority
WO
WIPO (PCT)
Prior art keywords
fence
shielding
circuit board
printed circuit
perimeter
Prior art date
Application number
PCT/US2001/046122
Other languages
French (fr)
Other versions
WO2002041679A2 (en
Inventor
Michael J Oliver
James E Kline
Original Assignee
Laird Technologies Inc
Michael J Oliver
James E Kline
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc, Michael J Oliver, James E Kline filed Critical Laird Technologies Inc
Priority to US10/416,872 priority Critical patent/US20040052064A1/en
Priority to AU2002220163A priority patent/AU2002220163A1/en
Publication of WO2002041679A2 publication Critical patent/WO2002041679A2/en
Publication of WO2002041679A3 publication Critical patent/WO2002041679A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electromagnetic shield (10) includes an electrically conductive contact strip arranged to form a perimeter fence (12). The contact strip used to form the shielding fence is oriented such that the contact fingers (22) are vertical to the printed circuit board and the spring fingers face inward toward a heat producing device (26). A shielding lid, which also functions as a heat sink (16) for cooling the device, makes electrical contact around the perimeter thereof by sliding down across the contact portions of each finger (22) of the fence, and thereby coming to rest on the heat producing device (26), either directly or through a thermally conductive interface. A spring clip (24) which holds the heat sink in place over the heat producing device is designed to clip into opposite sides of the perimeter fence below the row of spring fingers (22), thereby forming a unitary shielding and cooling device.
PCT/US2001/046122 2000-11-15 2001-11-15 Electromagnetic shielding and cooling device for printed circuit board WO2002041679A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/416,872 US20040052064A1 (en) 2001-11-15 2001-11-15 Electromagnetic shielding and cooling device for printed circuit board
AU2002220163A AU2002220163A1 (en) 2000-11-15 2001-11-15 Electromagnetic shielding and cooling device for printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24820300P 2000-11-15 2000-11-15
US60/248,203 2000-11-15

Publications (2)

Publication Number Publication Date
WO2002041679A2 WO2002041679A2 (en) 2002-05-23
WO2002041679A3 true WO2002041679A3 (en) 2002-08-29

Family

ID=22938123

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/046122 WO2002041679A2 (en) 2000-11-15 2001-11-15 Electromagnetic shielding and cooling device for printed circuit board

Country Status (2)

Country Link
AU (1) AU2002220163A1 (en)
WO (1) WO2002041679A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030067757A1 (en) * 2001-10-05 2003-04-10 Richardson Patrick J. Apparatus and method for shielding a device
JP2003298283A (en) 2002-03-28 2003-10-17 Seiko Epson Corp Electromagnetic wave shielding member and recording device
TWI404957B (en) * 2010-11-16 2013-08-11 Univ Lunghwa Sci & Technology ?modulated breadboard with electromagnetic interference prevention function
TWI488155B (en) * 2013-09-30 2015-06-11 唐明中 An assisting device for constructing circuit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
EP0632686A1 (en) * 1993-06-29 1995-01-04 Telefonaktiebolaget Lm Ericsson A device for shielding and/or cooling electronic components
US5541811A (en) * 1994-04-11 1996-07-30 Telefonaktiebolaget Lm Ericsson Shielding and cooling arrangement
US5717248A (en) * 1994-03-14 1998-02-10 Siemens Nixdorf Informationssysteme Ag Cooling and screening device having contact pins for an integrated circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
EP0632686A1 (en) * 1993-06-29 1995-01-04 Telefonaktiebolaget Lm Ericsson A device for shielding and/or cooling electronic components
US5717248A (en) * 1994-03-14 1998-02-10 Siemens Nixdorf Informationssysteme Ag Cooling and screening device having contact pins for an integrated circuit
US5541811A (en) * 1994-04-11 1996-07-30 Telefonaktiebolaget Lm Ericsson Shielding and cooling arrangement

Also Published As

Publication number Publication date
WO2002041679A2 (en) 2002-05-23
AU2002220163A1 (en) 2002-05-27

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