JPS6125271Y2 - - Google Patents
Info
- Publication number
- JPS6125271Y2 JPS6125271Y2 JP1980087963U JP8796380U JPS6125271Y2 JP S6125271 Y2 JPS6125271 Y2 JP S6125271Y2 JP 1980087963 U JP1980087963 U JP 1980087963U JP 8796380 U JP8796380 U JP 8796380U JP S6125271 Y2 JPS6125271 Y2 JP S6125271Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- optical
- semiconductor element
- connector
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 15
- 230000009977 dual effect Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Optical Communication System (AREA)
Description
【考案の詳細な説明】
本考案は光通信用の送受信装置の改良に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a transmitter/receiver for optical communication.
近年電子部品の形状は半導体ICの普及に伴い
著しく小型化されて来ているが、光通信用の送受
信機も取扱の便利な小型化が要求されている。そ
のため半導体ICと光素子とを用いてモジユール
化したものが開発されている。第１図はその１例
を示したものである。これについて簡単に説明す
ると発光又は受光用の光半導体素子１とLSI２、
接続用端子３を有するパツケージ４を光コネクタ
５と共に基台６の上に搭載している。この光通信
モジユールは電子回路をそのままとし光半導体素
子のみを交換して仕様を変更しようとする場合、
あるいは光半導体素子の寿命による交換などを行
なうことは光半導体素子が電子回路と同一パツケ
ージ内にあるため不可能に近い。本考案はこの欠
点を改良するために案出されたものである。 In recent years, the shape of electronic components has become significantly smaller with the spread of semiconductor ICs, and optical communication transmitters and receivers are also required to be smaller and more convenient to handle. Therefore, modules using semiconductor ICs and optical elements have been developed. FIG. 1 shows one example. To briefly explain this, an optical semiconductor element 1 for emitting or receiving light, an LSI 2,
A package 4 having connection terminals 3 is mounted on a base 6 together with an optical connector 5. If you want to change the specifications of this optical communication module by leaving the electronic circuit as is and replacing only the optical semiconductor element,
Furthermore, it is almost impossible to replace the optical semiconductor element due to its lifespan because the optical semiconductor element and the electronic circuit are in the same package. The present invention was devised to improve this drawback.
このため本考案の光通信モジユールにおいて
は、金属製の基台と、該基台にねじにより結合で
きる固定ブロツク部分を有する光コネクタとを設
け、前記基台にはデユアルインライン型ハイブリ
ツドICを搭載し、前記光コネクタは前記基台と
の間に発光又は受光用の光半導体素子を具えて前
記ねじにより前記基台と着脱可能に結合したこと
を特徴とするものである。 For this reason, the optical communication module of the present invention is provided with a metal base and an optical connector having a fixed block portion that can be connected to the base with screws, and a dual in-line hybrid IC is mounted on the base. , the optical connector is characterized in that a light emitting or light receiving optical semiconductor element is provided between the optical connector and the base, and the optical connector is removably connected to the base using the screw.
以下添付図面に基づいて本考案の実施例につき
詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第３図に実施例の斜視図を示す。図により説明
すると符号７はＬ字形をした基台であつて熱伝導
の良い金属で形成されている。８は基台の上に搭
載固着された主要電気回路であるデユアルインラ
イン型ハイブリツドICであり、９はその端子、
１０は蓋である。また１１はねじ１２により基台
７に結合された光コネクタである。そして第４図
の上面より見た断面図および第４図の−線に
おける断面図に示す第５図の如く光コネクタ１１
には固定ブロツク部分１３があり、該部は基台７
との間に光半導体素子１４を具えてねじ１２によ
り基台７に固定されている。なお光半導体素子１
４のリード線１４ａはハイブリツドICの基板１
５に設けられたコネクタ１６に挿入され電気的接
続が行なわれている。 FIG. 3 shows a perspective view of the embodiment. To explain with reference to the drawings, reference numeral 7 denotes an L-shaped base made of metal with good thermal conductivity. 8 is a dual in-line hybrid IC which is the main electric circuit mounted and fixed on the base, 9 is its terminal,
10 is a lid. Further, reference numeral 11 denotes an optical connector coupled to the base 7 with screws 12. The optical connector 11 is shown in FIG. 5, which is a sectional view taken from the top of FIG.
has a fixed block part 13, which part is attached to the base 7.
An optical semiconductor element 14 is provided between the two and fixed to the base 7 with screws 12. Note that the optical semiconductor element 1
The lead wire 14a of No. 4 is connected to the board 1 of the hybrid IC.
It is inserted into a connector 16 provided at 5 for electrical connection.
このよいに構成された本実施例は光半導体素子
１４を仕様の変更、あるいは寿命により交換しよ
うとするときは、ねじ１２をはずすことにより光
コネクタ１１を基台７より取外し、光半導体素子
のリード線１４ａをコネクタ１６より引抜いて交
換することができる。また使用時における光半導
体素子１４およびハイブリツドIC８′よりの発熱
は基台７に伝達され、これらによつて放熱され、
また電気シールド機能も有する。なお本実施例を
プリント板に実装するときに、この基台７をプリ
ント板側の放熱体に接触せしめれば更に効果は大
である。 In this well-constructed embodiment, when the optical semiconductor element 14 is to be replaced due to specification changes or due to end of life, the optical connector 11 can be removed from the base 7 by removing the screw 12, and the leads of the optical semiconductor element can be replaced. The wire 14a can be pulled out from the connector 16 and replaced. Furthermore, heat generated by the optical semiconductor element 14 and the hybrid IC 8' during use is transmitted to the base 7, where the heat is radiated.
It also has an electrical shielding function. Incidentally, when this embodiment is mounted on a printed board, the effect will be even greater if this base 7 is brought into contact with a heat sink on the printed board side.
以上説明した如く本考案の光通信モジユールは
デユアルインライン型ハイブリツドICを放熱と
電気シールドを兼ねた基台に搭載することにより
小型化が可能となり、また光コネクタを基台にね
じにより固定することにより内装する光半導体素
子の交換を簡単容易としたものである。 As explained above, the optical communication module of the present invention can be miniaturized by mounting a dual in-line hybrid IC on a base that serves as a heat dissipation and electrical shield, and by fixing the optical connector to the base with screws. This makes it easy to replace the internal optical semiconductor elements.
第１図は従来の光通信モジユールの１例の上面
図、第２図は第１図の−線における断面図、
第３図乃至第５図は本考案にかかる実施例の光通
信モジユールであつて、第３図は斜視図、第４図
は上面より見た断面図、第５図は第４図の−
線における断面図である。
７……基台、８……デユアルインライン型ハイ
ブリツドIC、１１……光コネクタ、１２……ね
じ、１４……光半導体素子。
FIG. 1 is a top view of an example of a conventional optical communication module, and FIG. 2 is a sectional view taken along the - line in FIG.
3 to 5 show an optical communication module according to an embodiment of the present invention, in which FIG. 3 is a perspective view, FIG. 4 is a sectional view seen from the top, and FIG.
FIG. 7... Base, 8... Dual in-line hybrid IC, 11... Optical connector, 12... Screw, 14... Optical semiconductor element.
Claims (1)
定ブロツク部分を有する光コネクタとを設け、前
記基台にはデユアルインライン型ハイブリツド
ICを搭載し、前記光コネクタは前記基台との間
に発光又は受光用の光半導体素子を具えて前記ね
じにより前記基台と着脱可能に結合したことを特
徴とする光通信モジユール。 A metal base and an optical connector having a fixing block part that can be twistedly connected to the base are provided, and the base has a dual in-line hybrid connector.
An optical communication module equipped with an IC, wherein the optical connector is provided with an optical semiconductor element for emitting or receiving light between the base and the base, and is removably connected to the base using the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980087963U JPS6125271Y2 (en) | 1980-06-25 | 1980-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980087963U JPS6125271Y2 (en) | 1980-06-25 | 1980-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5712768U JPS5712768U (en) | 1982-01-22 |
| JPS6125271Y2 true JPS6125271Y2 (en) | 1986-07-29 |
Family
ID=29450054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980087963U Expired JPS6125271Y2 (en) | 1980-06-25 | 1980-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6125271Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939955U (en) * | 1982-09-06 | 1984-03-14 | 防衛庁技術研究本部長 | Hybrid IC package |
| JP2506067Y2 (en) * | 1987-11-30 | 1996-08-07 | 日本電気株式会社 | Structure of optical transmitter |
-
1980
- 1980-06-25 JP JP1980087963U patent/JPS6125271Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5712768U (en) | 1982-01-22 |
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