JPS56167333A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56167333A JPS56167333A JP6981980A JP6981980A JPS56167333A JP S56167333 A JPS56167333 A JP S56167333A JP 6981980 A JP6981980 A JP 6981980A JP 6981980 A JP6981980 A JP 6981980A JP S56167333 A JPS56167333 A JP S56167333A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- layer
- coating
- protective coating
- atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6981980A JPS56167333A (en) | 1980-05-26 | 1980-05-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6981980A JPS56167333A (en) | 1980-05-26 | 1980-05-26 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56167333A true JPS56167333A (en) | 1981-12-23 |
JPS6255696B2 JPS6255696B2 (fr) | 1987-11-20 |
Family
ID=13413740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6981980A Granted JPS56167333A (en) | 1980-05-26 | 1980-05-26 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56167333A (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63189254A (ja) * | 1987-01-31 | 1988-08-04 | Toshiba Corp | サ−マルヘツド |
JPH01123428A (ja) * | 1987-11-06 | 1989-05-16 | Mitsubishi Electric Corp | 半導体装置 |
US5198685A (en) * | 1990-08-01 | 1993-03-30 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus with shock-absorbing layer |
US5646440A (en) * | 1994-10-03 | 1997-07-08 | Sony Corporation | Interlayer dielectric structure for semiconductor device |
JP2013191716A (ja) * | 2012-03-14 | 2013-09-26 | Hitachi Ltd | SiC素子搭載パワー半導体モジュール |
-
1980
- 1980-05-26 JP JP6981980A patent/JPS56167333A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63189254A (ja) * | 1987-01-31 | 1988-08-04 | Toshiba Corp | サ−マルヘツド |
JPH01123428A (ja) * | 1987-11-06 | 1989-05-16 | Mitsubishi Electric Corp | 半導体装置 |
US5198685A (en) * | 1990-08-01 | 1993-03-30 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus with shock-absorbing layer |
US5646440A (en) * | 1994-10-03 | 1997-07-08 | Sony Corporation | Interlayer dielectric structure for semiconductor device |
JP2013191716A (ja) * | 2012-03-14 | 2013-09-26 | Hitachi Ltd | SiC素子搭載パワー半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JPS6255696B2 (fr) | 1987-11-20 |
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