JPS56142642A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56142642A
JPS56142642A JP4470580A JP4470580A JPS56142642A JP S56142642 A JPS56142642 A JP S56142642A JP 4470580 A JP4470580 A JP 4470580A JP 4470580 A JP4470580 A JP 4470580A JP S56142642 A JPS56142642 A JP S56142642A
Authority
JP
Japan
Prior art keywords
silicon dioxide
film
flow rate
ratio
rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4470580A
Other languages
Japanese (ja)
Inventor
Toshiji Yamauchi
Isao Tachikake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4470580A priority Critical patent/JPS56142642A/en
Publication of JPS56142642A publication Critical patent/JPS56142642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide

Abstract

PURPOSE:To form an opening, edge sections thereof are smooth, by a method wherein a silicon dioxide film is made up on a silicon substrate by vapor growth increasing the mixed ratio of a gas containing oxygen to a gas containing silicon, and the film is etched selectively. CONSTITUTION:A wafer is installed into a reaction tube of a vapor growing device, and silane is supplied at the rate of 1.5l per minute under a condition of 850 deg.C temperature and 1.3 Torr pressure. At the same time, nitrogen monoxide is fed increasing the flow rate gradually from the rate of 0.3l per minute, and silicon dioxide 2 is grown. The ratio of the flow rate of silane gas and nitrogen monoxide gas is increased by stages in ratios, such as 20%, 30%, 40%, 50%, 60% and 70%. A resist is applied to the silicon dioxide film 2, and a window for an electrode is made up by an etching liquid of a hydrofluoric acid group. When the ratio of flow rate is large, since silicon dioxide, etching speed thereof is fast, grows the film near the surface is etched more rapidly, and the window for the electrode, edge sections thereof are smooth, is obtained.
JP4470580A 1980-04-07 1980-04-07 Manufacture of semiconductor device Pending JPS56142642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4470580A JPS56142642A (en) 1980-04-07 1980-04-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4470580A JPS56142642A (en) 1980-04-07 1980-04-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56142642A true JPS56142642A (en) 1981-11-07

Family

ID=12698827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4470580A Pending JPS56142642A (en) 1980-04-07 1980-04-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56142642A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111368A (en) * 1982-12-17 1984-06-27 Seiko Instr & Electronics Ltd Thin film transistor
JPS61245560A (en) * 1985-04-23 1986-10-31 Agency Of Ind Science & Technol Capacitor for semiconductor integrated circuit
JPH04229537A (en) * 1990-05-16 1992-08-19 Philips Gloeilampenfab:Nv Short focal distance video color projector using two-color mirror
JPH06310504A (en) * 1993-04-27 1994-11-04 Nec Corp Insulation film structure and its manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421289A (en) * 1977-07-19 1979-02-17 Mitsubishi Electric Corp Manufacture for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421289A (en) * 1977-07-19 1979-02-17 Mitsubishi Electric Corp Manufacture for semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111368A (en) * 1982-12-17 1984-06-27 Seiko Instr & Electronics Ltd Thin film transistor
JPS61245560A (en) * 1985-04-23 1986-10-31 Agency Of Ind Science & Technol Capacitor for semiconductor integrated circuit
JPH04229537A (en) * 1990-05-16 1992-08-19 Philips Gloeilampenfab:Nv Short focal distance video color projector using two-color mirror
JPH06310504A (en) * 1993-04-27 1994-11-04 Nec Corp Insulation film structure and its manufacturing method

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