JPS5613722A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5613722A JPS5613722A JP8952579A JP8952579A JPS5613722A JP S5613722 A JPS5613722 A JP S5613722A JP 8952579 A JP8952579 A JP 8952579A JP 8952579 A JP8952579 A JP 8952579A JP S5613722 A JPS5613722 A JP S5613722A
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- injection
- mask
- semiconductor substrate
- high molecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000002347 injection Methods 0.000 abstract 6
- 239000007924 injection Substances 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 6
- 150000002500 ions Chemical class 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 4
- 239000004642 Polyimide Substances 0.000 abstract 3
- 229920001721 polyimide Polymers 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000011259 mixed solution Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8952579A JPS5613722A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8952579A JPS5613722A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5613722A true JPS5613722A (en) | 1981-02-10 |
JPS6117135B2 JPS6117135B2 (zh) | 1986-05-06 |
Family
ID=13973214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8952579A Granted JPS5613722A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5613722A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599981A (ja) * | 1982-07-07 | 1984-01-19 | Sumitomo Electric Ind Ltd | 半導体発光装置 |
EP0851468A2 (en) * | 1996-12-31 | 1998-07-01 | Lucent Technologies Inc. | Method of making integrated circuit with twin tub |
CN100382246C (zh) * | 2003-04-25 | 2008-04-16 | 住友电气工业株式会社 | 半导体装置的制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0318619A (ja) * | 1989-06-14 | 1991-01-28 | Nissan Motor Co Ltd | 渦流室式ディーゼル機関の燃焼室 |
-
1979
- 1979-07-13 JP JP8952579A patent/JPS5613722A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599981A (ja) * | 1982-07-07 | 1984-01-19 | Sumitomo Electric Ind Ltd | 半導体発光装置 |
EP0851468A2 (en) * | 1996-12-31 | 1998-07-01 | Lucent Technologies Inc. | Method of making integrated circuit with twin tub |
EP0851468A3 (en) * | 1996-12-31 | 1998-08-05 | Lucent Technologies Inc. | Method of making integrated circuit with twin tub |
US6017787A (en) * | 1996-12-31 | 2000-01-25 | Lucent Technologies Inc. | Integrated circuit with twin tub |
CN100382246C (zh) * | 2003-04-25 | 2008-04-16 | 住友电气工业株式会社 | 半导体装置的制造方法 |
US7364978B2 (en) | 2003-04-25 | 2008-04-29 | Sumitomo Electric Industries, Ltd. | Method of fabricating semiconductor device |
US7759211B2 (en) | 2003-04-25 | 2010-07-20 | Sumitomo Electric Industries, Ltd. | Method of fabricating semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6117135B2 (zh) | 1986-05-06 |
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