JPS56135943A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56135943A
JPS56135943A JP3941080A JP3941080A JPS56135943A JP S56135943 A JPS56135943 A JP S56135943A JP 3941080 A JP3941080 A JP 3941080A JP 3941080 A JP3941080 A JP 3941080A JP S56135943 A JPS56135943 A JP S56135943A
Authority
JP
Japan
Prior art keywords
wiring region
terminals
wiring
constitution
compared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3941080A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP3941080A priority Critical patent/JPS56135943A/en
Publication of JPS56135943A publication Critical patent/JPS56135943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the cost for the device by dividing a wiring region into three in a master slice method and thereby contracting the size of a master chip as compared with conventional ones. CONSTITUTION:The wiring region 23 is formed between block lines 21 and 22 such as a gate and a flip-flop having a logic function. This wiring region 23 is divided into a wiring region 23a in the block line 21, a wiring region 23b in the block line 22 and a wiring region 23c for connecting the wiring regions 23a and 23b with each other. In the wiring region 23a a plurality of terminals 24, 24... are arranged regularly, while in the wiring region 23b a plurality of terminals 25, 25... are also arranged regularly, and the wiring region 23c is constituted by wirings 26, 26... arranged correspondingly to the terminals 24 and 25. By this constitution, the length in the lateral direction of the block lines 21 and 22 can be contracted sharply as compared with the conventional ones, and the size of the master chip can also be decreased since the increase of the length in the longitudinal direction is slight.
JP3941080A 1980-03-27 1980-03-27 Semiconductor device Pending JPS56135943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3941080A JPS56135943A (en) 1980-03-27 1980-03-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3941080A JPS56135943A (en) 1980-03-27 1980-03-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56135943A true JPS56135943A (en) 1981-10-23

Family

ID=12552215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3941080A Pending JPS56135943A (en) 1980-03-27 1980-03-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56135943A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110967A (en) * 1988-10-19 1990-04-24 Nec Corp Manufacture of semiconductor integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110967A (en) * 1988-10-19 1990-04-24 Nec Corp Manufacture of semiconductor integrated circuit

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