JPS56133632A - Manufacture of infrared-ray detector - Google Patents
Manufacture of infrared-ray detectorInfo
- Publication number
- JPS56133632A JPS56133632A JP3804380A JP3804380A JPS56133632A JP S56133632 A JPS56133632 A JP S56133632A JP 3804380 A JP3804380 A JP 3804380A JP 3804380 A JP3804380 A JP 3804380A JP S56133632 A JPS56133632 A JP S56133632A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- crystal wafer
- photodetection
- pyroelectric
- pyroelectric crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
Abstract
PURPOSE:To obtain a device having desired characteristic with excellent mass- producibility by forming photodetection electrodes by applying an polishing conductive paste after forming a reverse surface electrode on a pyroelectric crystal wafer, and further by cutting the pyroelectric crystal wafer. CONSTITUTION:On the reverse surface of pyroelectric crystal wafer 11, reverse- surface electrode 12 is provided and conductive thick-film paste 14 is further applied. Next, pyroelectric crystal wafer 11 is polished into a thin plate to form photodetection electrodes 15. Next, bonding electrodes 16 are formed at edge parts of photodetection electrodes 15. Then, pyroelectric crystal wafer 11 is cut into pyroelectric material chips so that while conductive thick-film paste 14 is separated, photodetection electrodes 15 will be separated individually. Next, a pyroelectric material chip is fixed on mount base 18 and bonding electrode 16 and lead body 20 are connected together via lead wire 22.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3804380A JPS56133632A (en) | 1980-03-25 | 1980-03-25 | Manufacture of infrared-ray detector |
CA000360797A CA1175130A (en) | 1979-09-25 | 1980-09-23 | Pyroelectric detector and method for manufacturing same |
US06/190,161 US4383174A (en) | 1979-09-25 | 1980-09-23 | Pyroelectric detector and method for manufacturing the same |
DE3035933A DE3035933C2 (en) | 1979-09-25 | 1980-09-24 | Pyroelectric detector and method for manufacturing such a detector |
GB8030792A GB2061616B (en) | 1979-09-25 | 1980-09-24 | Pyroelectric detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3804380A JPS56133632A (en) | 1980-03-25 | 1980-03-25 | Manufacture of infrared-ray detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56133632A true JPS56133632A (en) | 1981-10-19 |
Family
ID=12514497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3804380A Pending JPS56133632A (en) | 1979-09-25 | 1980-03-25 | Manufacture of infrared-ray detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56133632A (en) |
-
1980
- 1980-03-25 JP JP3804380A patent/JPS56133632A/en active Pending
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