JPS56129324A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56129324A
JPS56129324A JP3298480A JP3298480A JPS56129324A JP S56129324 A JPS56129324 A JP S56129324A JP 3298480 A JP3298480 A JP 3298480A JP 3298480 A JP3298480 A JP 3298480A JP S56129324 A JPS56129324 A JP S56129324A
Authority
JP
Japan
Prior art keywords
film
resist
sio2
layer
photo etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3298480A
Other languages
Japanese (ja)
Inventor
Kazutoshi Nagano
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3298480A priority Critical patent/JPS56129324A/en
Publication of JPS56129324A publication Critical patent/JPS56129324A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step

Abstract

PURPOSE:To expose the metallic film at an electrode window section with flatness and no disconnection by degenerating photosensitive resin on the metallic film provided on a semiconductor substrate by plasma process or ion implantation wherein the film is then opened by placing an insulating film on the film and photo etching is applied to the exposed resin. CONSTITUTION:An opening is provided at an SiO2 24 on an Si substrate 21 formed a diffusion layer to form an Al film 26. With a plasma process such as N2 or the like applied by forming a resist mask 28, the surface layer of the resist becomes hard and degenerates and will not be dissolved, evaporated, carbonized at about 500 deg.C. Next, vapor growth is done to an SiO2 film 30 at 450 deg.C, for example and photo etching is performed to the SiO2 30 by etchants of HF group by applying a resist mask 31. At that time, abnoraml photo etching will not be recognized at the opposite ends of a predetermined region 32 owing to the existence of the degenerated resist film 28 and the surface of the Al layer is flat and no breakage of wiring is expected as the Al layer does not contact with the etchants. Finally, the resist 28 is removed by O2 plasma or the like to complete a semiconductor device.
JP3298480A 1980-03-14 1980-03-14 Manufacture of semiconductor device Pending JPS56129324A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3298480A JPS56129324A (en) 1980-03-14 1980-03-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3298480A JPS56129324A (en) 1980-03-14 1980-03-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56129324A true JPS56129324A (en) 1981-10-09

Family

ID=12374133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3298480A Pending JPS56129324A (en) 1980-03-14 1980-03-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56129324A (en)

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