JPS5612744A - Wafer prober - Google Patents
Wafer proberInfo
- Publication number
- JPS5612744A JPS5612744A JP8856979A JP8856979A JPS5612744A JP S5612744 A JPS5612744 A JP S5612744A JP 8856979 A JP8856979 A JP 8856979A JP 8856979 A JP8856979 A JP 8856979A JP S5612744 A JPS5612744 A JP S5612744A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- stylus
- prober
- polishing
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 abstract 3
- 239000000523 sample Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8856979A JPS5612744A (en) | 1979-07-12 | 1979-07-12 | Wafer prober |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8856979A JPS5612744A (en) | 1979-07-12 | 1979-07-12 | Wafer prober |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5612744A true JPS5612744A (en) | 1981-02-07 |
| JPS5759668B2 JPS5759668B2 (en, 2012) | 1982-12-15 |
Family
ID=13946488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8856979A Granted JPS5612744A (en) | 1979-07-12 | 1979-07-12 | Wafer prober |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5612744A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4751458A (en) * | 1984-04-02 | 1988-06-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Test pads for integrated circuit chips |
| JPS64742A (en) * | 1987-03-24 | 1989-01-05 | Tokyo Electron Ltd | Probing device |
| US6024629A (en) * | 1997-01-22 | 2000-02-15 | Tokyo Electron Limited | Probe apparatus and a method for polishing a probe |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6183969U (en, 2012) * | 1984-11-06 | 1986-06-03 |
-
1979
- 1979-07-12 JP JP8856979A patent/JPS5612744A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4751458A (en) * | 1984-04-02 | 1988-06-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Test pads for integrated circuit chips |
| JPS64742A (en) * | 1987-03-24 | 1989-01-05 | Tokyo Electron Ltd | Probing device |
| US6024629A (en) * | 1997-01-22 | 2000-02-15 | Tokyo Electron Limited | Probe apparatus and a method for polishing a probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5759668B2 (en, 2012) | 1982-12-15 |
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