JPS56124263A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56124263A JPS56124263A JP2663880A JP2663880A JPS56124263A JP S56124263 A JPS56124263 A JP S56124263A JP 2663880 A JP2663880 A JP 2663880A JP 2663880 A JP2663880 A JP 2663880A JP S56124263 A JPS56124263 A JP S56124263A
- Authority
- JP
- Japan
- Prior art keywords
- type
- layer
- electrodes
- cathode
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/408—Electrodes ; Multistep manufacturing processes therefor with an insulating layer with a particular dielectric or electrostatic property, e.g. with static charges or for controlling trapped charges or moving ions, or with a plate acting on the insulator potential or the insulator charges, e.g. for controlling charges effect or potential distribution in the insulating layer, or with a semi-insulating layer contacting directly the semiconductor surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
Abstract
PURPOSE:To obtain a device provided with a highly reliable blocking capability, by providing collector electrodes in such a manner as to stick out from circumferences of both main surfaces of a semiconductor substrate whose p-n joint is exposed to the side surface, and also by covering side surfaces of the both electrodes with protective membranes. CONSTITUTION:A thick p type emitter layer 1 and a thin p type base layer 3 are formed on an n type Si 2, and an n type emitter layer 4 is selectively arranged on the layer 3. An anode 5, a cathode 6 and a control electrode 7 are provided in contact with respective main surface 101 and 102, and in a region 41, the p base 3 and the n emitter 4 are shortcircuited by the cathode 6. A side surface 103, where p-n joints J1 and J2 are exposed, is so processed as to become positive level. In contact with end sections 300 and 400 of respective main surfaces, ohmic electrodes 8 and 9 are provided in such a manner as to stick out from the circumferencial edge and form an annular configuration. As small amount of impurity iron is accumulated on surface of a semiconductor, it is possible to obtain an extremely stable device without allowing leak current to increase.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2663880A JPS56124263A (en) | 1980-03-05 | 1980-03-05 | Semiconductor device |
DE3024939A DE3024939C3 (en) | 1979-07-02 | 1980-07-01 | Semiconductor device |
US06/164,946 US4388635A (en) | 1979-07-02 | 1980-07-01 | High breakdown voltage semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2663880A JPS56124263A (en) | 1980-03-05 | 1980-03-05 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56124263A true JPS56124263A (en) | 1981-09-29 |
JPS639670B2 JPS639670B2 (en) | 1988-03-01 |
Family
ID=12198982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2663880A Granted JPS56124263A (en) | 1979-07-02 | 1980-03-05 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56124263A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561977A (en) * | 1983-03-08 | 1985-12-31 | Nissan Motor Company, Limited | Contractible fuel filter device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH076841U (en) * | 1993-06-23 | 1995-01-31 | 株式会社三協精機製作所 | Magnetic / IC dual card reader |
US8872751B2 (en) | 2009-03-26 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device having interconnected transistors and electronic device including the same |
-
1980
- 1980-03-05 JP JP2663880A patent/JPS56124263A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561977A (en) * | 1983-03-08 | 1985-12-31 | Nissan Motor Company, Limited | Contractible fuel filter device |
Also Published As
Publication number | Publication date |
---|---|
JPS639670B2 (en) | 1988-03-01 |
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