JPS56124252A - Heat-dissipating device for semiconductor - Google Patents

Heat-dissipating device for semiconductor

Info

Publication number
JPS56124252A
JPS56124252A JP2692780A JP2692780A JPS56124252A JP S56124252 A JPS56124252 A JP S56124252A JP 2692780 A JP2692780 A JP 2692780A JP 2692780 A JP2692780 A JP 2692780A JP S56124252 A JPS56124252 A JP S56124252A
Authority
JP
Japan
Prior art keywords
heat
tightly closed
enamel
closed pipe
operating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2692780A
Other languages
English (en)
Inventor
Kikuo Wakino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2692780A priority Critical patent/JPS56124252A/ja
Publication of JPS56124252A publication Critical patent/JPS56124252A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2692780A 1980-03-03 1980-03-03 Heat-dissipating device for semiconductor Pending JPS56124252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2692780A JPS56124252A (en) 1980-03-03 1980-03-03 Heat-dissipating device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2692780A JPS56124252A (en) 1980-03-03 1980-03-03 Heat-dissipating device for semiconductor

Publications (1)

Publication Number Publication Date
JPS56124252A true JPS56124252A (en) 1981-09-29

Family

ID=12206800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2692780A Pending JPS56124252A (en) 1980-03-03 1980-03-03 Heat-dissipating device for semiconductor

Country Status (1)

Country Link
JP (1) JPS56124252A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2674989A1 (fr) * 1991-04-02 1992-10-09 Hitachi Ltd Dispositif de refroidissement pour un element semiconducteur.
DE102004028410A1 (de) * 2004-02-05 2005-09-01 Wincomm Corporation Vorrichtung zum Ableiten von Wärme
WO2019023296A1 (en) * 2017-07-28 2019-01-31 Qualcomm Incorporated SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2674989A1 (fr) * 1991-04-02 1992-10-09 Hitachi Ltd Dispositif de refroidissement pour un element semiconducteur.
DE102004028410A1 (de) * 2004-02-05 2005-09-01 Wincomm Corporation Vorrichtung zum Ableiten von Wärme
WO2019023296A1 (en) * 2017-07-28 2019-01-31 Qualcomm Incorporated SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE
US10622282B2 (en) 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device

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