JPS56122139A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56122139A JPS56122139A JP2523080A JP2523080A JPS56122139A JP S56122139 A JPS56122139 A JP S56122139A JP 2523080 A JP2523080 A JP 2523080A JP 2523080 A JP2523080 A JP 2523080A JP S56122139 A JPS56122139 A JP S56122139A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- leads
- semiconductor element
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To reduce the number of steps of laying a number of wires in a semiconductor device by containing a semiconductor element including electrodes to be bonded, a resin film having conductive leads and airtightly sealed container having metallized pattern for externally leading the electrodes in a superposed manner and respectively connecting the conductive parts. CONSTITUTION:Electrodes 22 to be bonded are formed on the upper surface of a semiconductor element 21, and metal is coated on the back surface thereof. The semiconductor element 21 is superposed on a resin film 24 having conductive leads 25, and heat treated and the electrodes 22 are secured to the leads 25 respectively. Subsequently, the semiconductor element 26 with the leads is placed on a mount 28 of a semiconductor accommodating container 27, and the leads 25 are pressed and heat treated onto a metallized pattern 30 for externally leading the electrodes. Thereafter, a cover 32 is airtightly sealed on a sealing ring 29. Thus, the number of steps of laying a number of the wires are reduced, and a high consumption power semiconductor device having reliability can be produced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2523080A JPS56122139A (en) | 1980-03-03 | 1980-03-03 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2523080A JPS56122139A (en) | 1980-03-03 | 1980-03-03 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56122139A true JPS56122139A (en) | 1981-09-25 |
Family
ID=12160163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2523080A Pending JPS56122139A (en) | 1980-03-03 | 1980-03-03 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56122139A (en) |
-
1980
- 1980-03-03 JP JP2523080A patent/JPS56122139A/en active Pending
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