JPS56120139A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56120139A JPS56120139A JP2276380A JP2276380A JPS56120139A JP S56120139 A JPS56120139 A JP S56120139A JP 2276380 A JP2276380 A JP 2276380A JP 2276380 A JP2276380 A JP 2276380A JP S56120139 A JPS56120139 A JP S56120139A
- Authority
- JP
- Japan
- Prior art keywords
- lead part
- metal
- semiconductor element
- electrode
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2276380A JPS56120139A (en) | 1980-02-27 | 1980-02-27 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2276380A JPS56120139A (en) | 1980-02-27 | 1980-02-27 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56120139A true JPS56120139A (en) | 1981-09-21 |
| JPS6258534B2 JPS6258534B2 (enExample) | 1987-12-07 |
Family
ID=12091709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2276380A Granted JPS56120139A (en) | 1980-02-27 | 1980-02-27 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56120139A (enExample) |
-
1980
- 1980-02-27 JP JP2276380A patent/JPS56120139A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258534B2 (enExample) | 1987-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1496994A (en) | Pastes for forming electrically conductive films on non-conductive substrates | |
| JPS55111151A (en) | Integrated circuit device | |
| GB1180368A (en) | Flat Package for Semiconductors | |
| GB1277254A (en) | Hermetically sealed package for use in electronic components | |
| MY117178A (en) | Conductive paste and ceramic electronic part including the same | |
| JPS56126951A (en) | Semicondutor device | |
| JPS56120139A (en) | Semiconductor device | |
| JPS5618448A (en) | Composite electronic part | |
| FR2629664B1 (fr) | Boitier pour circuits hybrides | |
| JPS56120138A (en) | Semiconductor device and its manufacture | |
| JPS556862A (en) | Mounting structure of ic for electronic timepiece | |
| JPS5487474A (en) | Semiconductor device | |
| JPS55123151A (en) | Integrated circuit device | |
| FR2380642A1 (fr) | Structure de scellement pour pile primaire ou secondaire et son procede de fabrication | |
| JPS55143054A (en) | Resin sealed semiconductor device | |
| JPS554904A (en) | Semi-conductor device | |
| JPS6482652A (en) | Manufacture of semiconductor device | |
| JPS5710951A (en) | Semiconductor device | |
| JPS635238Y2 (enExample) | ||
| Berry | Corrosion Resistance of Military Microelectronic Packages at the Lead/Glass Interface | |
| JPS57112054A (en) | Semiconductor device | |
| JPS5686454A (en) | Hermetic-sealed battery | |
| JPS57121239A (en) | Semiconductor device | |
| JPS5588324A (en) | Manufacture of semiconductor ohmic layer | |
| JPS5680151A (en) | Production of semiconductor device having plated projecting electrode |