JPS6258534B2 - - Google Patents

Info

Publication number
JPS6258534B2
JPS6258534B2 JP55022763A JP2276380A JPS6258534B2 JP S6258534 B2 JPS6258534 B2 JP S6258534B2 JP 55022763 A JP55022763 A JP 55022763A JP 2276380 A JP2276380 A JP 2276380A JP S6258534 B2 JPS6258534 B2 JP S6258534B2
Authority
JP
Japan
Prior art keywords
inner lead
electrode
metallization
outer lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55022763A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56120139A (en
Inventor
Kanji Ootsuka
Masao Sekihashi
Tamotsu Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2276380A priority Critical patent/JPS56120139A/ja
Publication of JPS56120139A publication Critical patent/JPS56120139A/ja
Publication of JPS6258534B2 publication Critical patent/JPS6258534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP2276380A 1980-02-27 1980-02-27 Semiconductor device Granted JPS56120139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2276380A JPS56120139A (en) 1980-02-27 1980-02-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2276380A JPS56120139A (en) 1980-02-27 1980-02-27 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56120139A JPS56120139A (en) 1981-09-21
JPS6258534B2 true JPS6258534B2 (enExample) 1987-12-07

Family

ID=12091709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2276380A Granted JPS56120139A (en) 1980-02-27 1980-02-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56120139A (enExample)

Also Published As

Publication number Publication date
JPS56120139A (en) 1981-09-21

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