JPS56110235A - Plasma etching device - Google Patents

Plasma etching device

Info

Publication number
JPS56110235A
JPS56110235A JP1401280A JP1401280A JPS56110235A JP S56110235 A JPS56110235 A JP S56110235A JP 1401280 A JP1401280 A JP 1401280A JP 1401280 A JP1401280 A JP 1401280A JP S56110235 A JPS56110235 A JP S56110235A
Authority
JP
Japan
Prior art keywords
chamber
etching
semiconductor wafer
wafers
plasma etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1401280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349373B2 (oth
Inventor
Seiji Imanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1401280A priority Critical patent/JPS56110235A/ja
Publication of JPS56110235A publication Critical patent/JPS56110235A/ja
Publication of JPS6349373B2 publication Critical patent/JPS6349373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP1401280A 1980-02-06 1980-02-06 Plasma etching device Granted JPS56110235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1401280A JPS56110235A (en) 1980-02-06 1980-02-06 Plasma etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1401280A JPS56110235A (en) 1980-02-06 1980-02-06 Plasma etching device

Publications (2)

Publication Number Publication Date
JPS56110235A true JPS56110235A (en) 1981-09-01
JPS6349373B2 JPS6349373B2 (oth) 1988-10-04

Family

ID=11849277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1401280A Granted JPS56110235A (en) 1980-02-06 1980-02-06 Plasma etching device

Country Status (1)

Country Link
JP (1) JPS56110235A (oth)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842235A (ja) * 1981-09-08 1983-03-11 Toshiba Corp 半導体乾式エツチング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421175A (en) * 1977-07-18 1979-02-17 Tokyo Ouka Kougiyou Kk Improvement of plasma reaction processor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421175A (en) * 1977-07-18 1979-02-17 Tokyo Ouka Kougiyou Kk Improvement of plasma reaction processor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842235A (ja) * 1981-09-08 1983-03-11 Toshiba Corp 半導体乾式エツチング装置

Also Published As

Publication number Publication date
JPS6349373B2 (oth) 1988-10-04

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