JPS5610941A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5610941A
JPS5610941A JP8626179A JP8626179A JPS5610941A JP S5610941 A JPS5610941 A JP S5610941A JP 8626179 A JP8626179 A JP 8626179A JP 8626179 A JP8626179 A JP 8626179A JP S5610941 A JPS5610941 A JP S5610941A
Authority
JP
Japan
Prior art keywords
substrate
power semiconductor
main electrodes
layer formed
solder layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8626179A
Other languages
English (en)
Inventor
Kazuo Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8626179A priority Critical patent/JPS5610941A/ja
Publication of JPS5610941A publication Critical patent/JPS5610941A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/90
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10W72/07536
    • H10W72/07551
    • H10W72/50
    • H10W72/5434
    • H10W72/59
    • H10W72/884
    • H10W72/934
    • H10W90/754

Landscapes

  • Wire Bonding (AREA)
JP8626179A 1979-07-06 1979-07-06 Semiconductor device Pending JPS5610941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8626179A JPS5610941A (en) 1979-07-06 1979-07-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8626179A JPS5610941A (en) 1979-07-06 1979-07-06 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5610941A true JPS5610941A (en) 1981-02-03

Family

ID=13881869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8626179A Pending JPS5610941A (en) 1979-07-06 1979-07-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5610941A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路

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