JPS56109219A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56109219A JPS56109219A JP1008380A JP1008380A JPS56109219A JP S56109219 A JPS56109219 A JP S56109219A JP 1008380 A JP1008380 A JP 1008380A JP 1008380 A JP1008380 A JP 1008380A JP S56109219 A JPS56109219 A JP S56109219A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- formula
- ether
- polyfunctional epoxy
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 3
- -1 ether imide compound Chemical class 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 abstract 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008380A JPS56109219A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008380A JPS56109219A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56109219A true JPS56109219A (en) | 1981-08-29 |
| JPS629250B2 JPS629250B2 (enrdf_load_stackoverflow) | 1987-02-27 |
Family
ID=11740447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1008380A Granted JPS56109219A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56109219A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03259914A (ja) * | 1990-03-09 | 1991-11-20 | Hitachi Ltd | 半導体封止用樹脂組成物および該組成物を用いた半導体装置 |
| JPH1045876A (ja) * | 1996-05-31 | 1998-02-17 | Mitsui Petrochem Ind Ltd | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |
| JPH10158363A (ja) * | 1996-11-29 | 1998-06-16 | Mitsui Chem Inc | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |
-
1980
- 1980-02-01 JP JP1008380A patent/JPS56109219A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03259914A (ja) * | 1990-03-09 | 1991-11-20 | Hitachi Ltd | 半導体封止用樹脂組成物および該組成物を用いた半導体装置 |
| JPH1045876A (ja) * | 1996-05-31 | 1998-02-17 | Mitsui Petrochem Ind Ltd | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |
| JPH10158363A (ja) * | 1996-11-29 | 1998-06-16 | Mitsui Chem Inc | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS629250B2 (enrdf_load_stackoverflow) | 1987-02-27 |
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