JPS56105645A - Copper alloy for lead and lead frame of semiconductor apparatus - Google Patents

Copper alloy for lead and lead frame of semiconductor apparatus

Info

Publication number
JPS56105645A
JPS56105645A JP842780A JP842780A JPS56105645A JP S56105645 A JPS56105645 A JP S56105645A JP 842780 A JP842780 A JP 842780A JP 842780 A JP842780 A JP 842780A JP S56105645 A JPS56105645 A JP S56105645A
Authority
JP
Japan
Prior art keywords
conductivity
copper
lead
strength
heat resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP842780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242976B2 (enExample
Inventor
Yasuo Yamane
Shigeo Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP842780A priority Critical patent/JPS56105645A/ja
Publication of JPS56105645A publication Critical patent/JPS56105645A/ja
Publication of JPS6242976B2 publication Critical patent/JPS6242976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/456—

Landscapes

  • Wire Bonding (AREA)
JP842780A 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus Granted JPS56105645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP842780A JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP842780A JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Publications (2)

Publication Number Publication Date
JPS56105645A true JPS56105645A (en) 1981-08-22
JPS6242976B2 JPS6242976B2 (enExample) 1987-09-10

Family

ID=11692817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP842780A Granted JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Country Status (1)

Country Link
JP (1) JPS56105645A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US4634824A (en) * 1981-10-13 1987-01-06 Tetsuo Takano Miniaturized electric contact assembly for microswitch
EP1420445A4 (en) * 2001-08-23 2009-04-08 Dowa Metaltech Co Ltd RADIATION PANEL AND POWER SEMICONDUCTOR MODULE, IC BUILDING BLOCK

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
JPS556498A (en) * 1979-06-25 1980-01-17 Kobe Steel Ltd Highly conductive copper alloy for electricity

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
JPS556498A (en) * 1979-06-25 1980-01-17 Kobe Steel Ltd Highly conductive copper alloy for electricity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634824A (en) * 1981-10-13 1987-01-06 Tetsuo Takano Miniaturized electric contact assembly for microswitch
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
EP1420445A4 (en) * 2001-08-23 2009-04-08 Dowa Metaltech Co Ltd RADIATION PANEL AND POWER SEMICONDUCTOR MODULE, IC BUILDING BLOCK

Also Published As

Publication number Publication date
JPS6242976B2 (enExample) 1987-09-10

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