JPS55115935A - Melting method for work hardening type copper alloy - Google Patents

Melting method for work hardening type copper alloy

Info

Publication number
JPS55115935A
JPS55115935A JP2294979A JP2294979A JPS55115935A JP S55115935 A JPS55115935 A JP S55115935A JP 2294979 A JP2294979 A JP 2294979A JP 2294979 A JP2294979 A JP 2294979A JP S55115935 A JPS55115935 A JP S55115935A
Authority
JP
Japan
Prior art keywords
alloy
added
copper alloy
melting method
work hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2294979A
Other languages
Japanese (ja)
Inventor
Kiyoshi Suzuki
Kazuhisa Masutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2294979A priority Critical patent/JPS55115935A/en
Publication of JPS55115935A publication Critical patent/JPS55115935A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enhance the mechanical properties, plastic workability and corrosion resistance of a Cu-Sn-P alloy by adding a specified amt. of Zn to the alloy in melting to control consumption of the Sn and P and increase the deoxidizing effect of the P.
CONSTITUTION: In refining a phosphor bronze type Cu alloy consisting of Sn 0.5W9%, P 0.03W0.35% and the balance Cu, Cu is first melted in the air, and Zn is added in the form of a Cu-Zn mother alloy to allow Zn 0.05W1.0% to be contained. Sn and P are then added in the form of a Cu-Sn mother alloy and a Cu-P mother alloy to allow Sn 0.5W9% and P 0.03W0.35% to be contained, and the resulting molten alloy is cast. By adding the Zn degassing and deoxidation are performed to prevent oxidation consumption of the Sn and P added thereafter and to enhance the deoxidizing effect of the P. Thus, an ingot giving an end product with little cracks is obtd. while maintaining superior mechanical properties, plastic workability and corrosion resistance.
COPYRIGHT: (C)1980,JPO&Japio
JP2294979A 1979-02-28 1979-02-28 Melting method for work hardening type copper alloy Pending JPS55115935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2294979A JPS55115935A (en) 1979-02-28 1979-02-28 Melting method for work hardening type copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2294979A JPS55115935A (en) 1979-02-28 1979-02-28 Melting method for work hardening type copper alloy

Publications (1)

Publication Number Publication Date
JPS55115935A true JPS55115935A (en) 1980-09-06

Family

ID=12096859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2294979A Pending JPS55115935A (en) 1979-02-28 1979-02-28 Melting method for work hardening type copper alloy

Country Status (1)

Country Link
JP (1) JPS55115935A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666667A (en) * 1984-05-22 1987-05-19 Nippon Mining Co., Ltd. High-strength, high-conductivity copper alloy
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666667A (en) * 1984-05-22 1987-05-19 Nippon Mining Co., Ltd. High-strength, high-conductivity copper alloy
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal

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