JPS56105645A - Copper alloy for lead and lead frame of semiconductor apparatus - Google Patents

Copper alloy for lead and lead frame of semiconductor apparatus

Info

Publication number
JPS56105645A
JPS56105645A JP842780A JP842780A JPS56105645A JP S56105645 A JPS56105645 A JP S56105645A JP 842780 A JP842780 A JP 842780A JP 842780 A JP842780 A JP 842780A JP S56105645 A JPS56105645 A JP S56105645A
Authority
JP
Japan
Prior art keywords
conductivity
copper
lead
strength
heat resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP842780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242976B2 (enrdf_load_html_response
Inventor
Yasuo Yamane
Shigeo Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP842780A priority Critical patent/JPS56105645A/ja
Publication of JPS56105645A publication Critical patent/JPS56105645A/ja
Publication of JPS6242976B2 publication Critical patent/JPS6242976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP842780A 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus Granted JPS56105645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP842780A JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP842780A JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Publications (2)

Publication Number Publication Date
JPS56105645A true JPS56105645A (en) 1981-08-22
JPS6242976B2 JPS6242976B2 (enrdf_load_html_response) 1987-09-10

Family

ID=11692817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP842780A Granted JPS56105645A (en) 1980-01-28 1980-01-28 Copper alloy for lead and lead frame of semiconductor apparatus

Country Status (1)

Country Link
JP (1) JPS56105645A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US4634824A (en) * 1981-10-13 1987-01-06 Tetsuo Takano Miniaturized electric contact assembly for microswitch
EP1420445A4 (en) * 2001-08-23 2009-04-08 Dowa Metaltech Co Ltd RADIATION PANEL AND POWER SEMICONDUCTOR MODULE, IC BUILDING BLOCK

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
JPS556498A (en) * 1979-06-25 1980-01-17 Kobe Steel Ltd Highly conductive copper alloy for electricity

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
JPS556498A (en) * 1979-06-25 1980-01-17 Kobe Steel Ltd Highly conductive copper alloy for electricity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634824A (en) * 1981-10-13 1987-01-06 Tetsuo Takano Miniaturized electric contact assembly for microswitch
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
EP1420445A4 (en) * 2001-08-23 2009-04-08 Dowa Metaltech Co Ltd RADIATION PANEL AND POWER SEMICONDUCTOR MODULE, IC BUILDING BLOCK

Also Published As

Publication number Publication date
JPS6242976B2 (enrdf_load_html_response) 1987-09-10

Similar Documents

Publication Publication Date Title
JPS5570494A (en) Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance
JPS5620135A (en) High-tensile electrically-conductive copper alloy
JPS6425929A (en) Copper alloy for electronic equipment
JPS56105645A (en) Copper alloy for lead and lead frame of semiconductor apparatus
JPS5568663A (en) Lead wire material for ic
JPS57108235A (en) Copper alloy for lead frame
JPS5521530A (en) High tensile copper alloy with superior heat resistance and conductivity
JPS57140234A (en) Trolley wire
JPS5665968A (en) Manufacture of electrically conductive aluminum alloy with high heat resistance
JPS57152437A (en) Low grade gold alloy
GB1137809A (en) Improvements relating to oxygen-free copper
JPS56156732A (en) Heat resistant copper alloy with high electrical conductivity
JPS52111815A (en) Steel material superior extremely in resistance for crack induced by h ydrogen
GB1399195A (en) Copper base alloy
JPS575834A (en) Heat resistant cu alloy having high electric conductivity
JPS53122786A (en) Composite trolley cable
JPS54119328A (en) Copper alloy for lead frames
RU1727403C1 (ru) Способ получения чушковых сплавов системы магний-алюминий-цинк-марганец
JPS5273118A (en) Periodic-damping alloy
GB1284197A (en) Copper alloys
JPS57169048A (en) High strength copper alloy with high electric conductivity
Furukawa Japan Continues Copper Cuts
JPS5741339A (en) Copper alloy for lead frame material of semiconductor element
JPS5713136A (en) High-strength copper alloy with high electric conductivity
JPS52138009A (en) Alloy steel wire for reinforcing glass