JPS6242976B2 - - Google Patents
Info
- Publication number
- JPS6242976B2 JPS6242976B2 JP55008427A JP842780A JPS6242976B2 JP S6242976 B2 JPS6242976 B2 JP S6242976B2 JP 55008427 A JP55008427 A JP 55008427A JP 842780 A JP842780 A JP 842780A JP S6242976 B2 JPS6242976 B2 JP S6242976B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- conductivity
- heat resistance
- strength
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP842780A JPS56105645A (en) | 1980-01-28 | 1980-01-28 | Copper alloy for lead and lead frame of semiconductor apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP842780A JPS56105645A (en) | 1980-01-28 | 1980-01-28 | Copper alloy for lead and lead frame of semiconductor apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56105645A JPS56105645A (en) | 1981-08-22 |
JPS6242976B2 true JPS6242976B2 (enrdf_load_html_response) | 1987-09-10 |
Family
ID=11692817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP842780A Granted JPS56105645A (en) | 1980-01-28 | 1980-01-28 | Copper alloy for lead and lead frame of semiconductor apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56105645A (enrdf_load_html_response) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2111306B (en) * | 1981-10-13 | 1985-06-12 | Tetsuo Takano | Electric switch contacts |
US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
JP4848539B2 (ja) * | 2001-08-23 | 2011-12-28 | Dowaメタルテック株式会社 | 放熱板およびパワー半導体モジュール、icパッケージ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5174925A (ja) * | 1974-12-26 | 1976-06-29 | Nippon Musical Instruments Mfg | Dogokin |
JPS556498A (en) * | 1979-06-25 | 1980-01-17 | Kobe Steel Ltd | Highly conductive copper alloy for electricity |
-
1980
- 1980-01-28 JP JP842780A patent/JPS56105645A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56105645A (en) | 1981-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5853057B2 (ja) | 高導電性銅基合金 | |
JPH0229737B2 (enrdf_load_html_response) | ||
JPS5834537B2 (ja) | 耐熱性の良好な高力導電用銅合金 | |
JP2516623B2 (ja) | 電子電気機器用銅合金とその製造法 | |
JPS6160846A (ja) | 半導体装置用銅合金リ−ド材 | |
JPS6158541B2 (enrdf_load_html_response) | ||
JPS63307232A (ja) | 銅合金 | |
JPS59170231A (ja) | 高力導電銅合金 | |
JPS58210140A (ja) | 伝導用耐熱銅合金 | |
JPS6242976B2 (enrdf_load_html_response) | ||
US4710349A (en) | Highly conductive copper-based alloy | |
JPS6256937B2 (enrdf_load_html_response) | ||
JPH0534409B2 (enrdf_load_html_response) | ||
JPS5952943B2 (ja) | 高耐熱性および高導電性を有するCu合金 | |
JPS6142772B2 (enrdf_load_html_response) | ||
JPS6017039A (ja) | 耐熱性、機械的特性、加工性及び導電性に優れた銅合金 | |
JPH0310696B2 (enrdf_load_html_response) | ||
JPS5952941B2 (ja) | 高導電性耐熱Cu合金 | |
JPS6239214B2 (enrdf_load_html_response) | ||
JPS63161134A (ja) | 電気部品用銅合金 | |
JP2001049366A (ja) | 耐熱性に優れた高強度高導電性銅合金 | |
JPS59166645A (ja) | ラジエ−タ−フイン用銅合金 | |
JPS6059979B2 (ja) | 高強度高導電性銅合金 | |
JPH02129326A (ja) | 高力銅合金 | |
JPH01263238A (ja) | 高強度高導電性銅合金 |