JPS56100459A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPS56100459A JPS56100459A JP402480A JP402480A JPS56100459A JP S56100459 A JPS56100459 A JP S56100459A JP 402480 A JP402480 A JP 402480A JP 402480 A JP402480 A JP 402480A JP S56100459 A JPS56100459 A JP S56100459A
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- copper
- projected
- pellet
- migration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP402480A JPS56100459A (en) | 1980-01-16 | 1980-01-16 | Electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP402480A JPS56100459A (en) | 1980-01-16 | 1980-01-16 | Electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56100459A true JPS56100459A (en) | 1981-08-12 |
Family
ID=11573385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP402480A Pending JPS56100459A (en) | 1980-01-16 | 1980-01-16 | Electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56100459A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02161759A (ja) * | 1988-12-14 | 1990-06-21 | Nec Corp | 樹脂封止型半導体装置 |
WO2004021436A1 (en) * | 2002-08-29 | 2004-03-11 | Freescale Semiconductor, Inc. | A packaged semiconductor with coated leads and method therefore |
-
1980
- 1980-01-16 JP JP402480A patent/JPS56100459A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02161759A (ja) * | 1988-12-14 | 1990-06-21 | Nec Corp | 樹脂封止型半導体装置 |
WO2004021436A1 (en) * | 2002-08-29 | 2004-03-11 | Freescale Semiconductor, Inc. | A packaged semiconductor with coated leads and method therefore |
US7105383B2 (en) | 2002-08-29 | 2006-09-12 | Freescale Semiconductor, Inc. | Packaged semiconductor with coated leads and method therefore |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5043534A (en) | Metal electronic package having improved resistance to electromagnetic interference | |
JPS56100459A (en) | Electronic component | |
DE2965205D1 (en) | Method of bonding metallic wires to microcircuit conductors | |
JPS58143541A (ja) | 半導体装置 | |
JPS6486527A (en) | Ccb tape carrier | |
JP2002324596A (ja) | 接続用リード線及びそれを用いた電気部品 | |
JPS56148857A (en) | Semiconductor device | |
JPS5536915A (en) | Electronic circuit and its manufacturing | |
JPS57130443A (en) | Substrate for hybrid integrated circuit | |
JPS5748253A (en) | Lead frame for semiconductor device | |
JPS57121255A (en) | Electric circuit element with metallic bump and mounting method of the seme | |
JPS5578536A (en) | Semiconductor device | |
JPS5694764A (en) | Protection method of semiconductor device | |
JPS56142659A (en) | Semiconductor device | |
JPS57154863A (en) | Manufacture of resin sealing type electronic parts | |
JPH03104131A (ja) | 半導体装置 | |
JPS57121239A (en) | Semiconductor device | |
JPH02130946A (ja) | 半導体装置 | |
JPS5552231A (en) | Semiconductor attaching device | |
JPS605224B2 (ja) | 集積回路用パツケ−ジ | |
JPS5640266A (en) | Preparation of hybrid integrated circuit device | |
JPS5743435A (en) | Electronic part | |
JPS57204139A (en) | Hybrid integrated circuit device | |
JPS57139948A (en) | Semiconductor device | |
JPS574160A (en) | Semiconductor device |