JPS5593231A - Assembling method of semicondcutor device - Google Patents

Assembling method of semicondcutor device

Info

Publication number
JPS5593231A
JPS5593231A JP194579A JP194579A JPS5593231A JP S5593231 A JPS5593231 A JP S5593231A JP 194579 A JP194579 A JP 194579A JP 194579 A JP194579 A JP 194579A JP S5593231 A JPS5593231 A JP S5593231A
Authority
JP
Japan
Prior art keywords
solder
regular
frame
brazing material
changed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP194579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222447B2 (enExample
Inventor
Makoto Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP194579A priority Critical patent/JPS5593231A/ja
Publication of JPS5593231A publication Critical patent/JPS5593231A/ja
Publication of JPS6222447B2 publication Critical patent/JPS6222447B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP194579A 1979-01-09 1979-01-09 Assembling method of semicondcutor device Granted JPS5593231A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP194579A JPS5593231A (en) 1979-01-09 1979-01-09 Assembling method of semicondcutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP194579A JPS5593231A (en) 1979-01-09 1979-01-09 Assembling method of semicondcutor device

Publications (2)

Publication Number Publication Date
JPS5593231A true JPS5593231A (en) 1980-07-15
JPS6222447B2 JPS6222447B2 (enExample) 1987-05-18

Family

ID=11515743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP194579A Granted JPS5593231A (en) 1979-01-09 1979-01-09 Assembling method of semicondcutor device

Country Status (1)

Country Link
JP (1) JPS5593231A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS424919Y1 (enExample) * 1964-11-19 1967-03-14
JPS5110769A (en) * 1974-07-16 1976-01-28 New Nippon Electric Co Handotaisochino seizohoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS424919Y1 (enExample) * 1964-11-19 1967-03-14
JPS5110769A (en) * 1974-07-16 1976-01-28 New Nippon Electric Co Handotaisochino seizohoho

Also Published As

Publication number Publication date
JPS6222447B2 (enExample) 1987-05-18

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