JPS5591852A - Hybrid semiconductor device containing elastic surface wave element - Google Patents

Hybrid semiconductor device containing elastic surface wave element

Info

Publication number
JPS5591852A
JPS5591852A JP16416378A JP16416378A JPS5591852A JP S5591852 A JPS5591852 A JP S5591852A JP 16416378 A JP16416378 A JP 16416378A JP 16416378 A JP16416378 A JP 16416378A JP S5591852 A JPS5591852 A JP S5591852A
Authority
JP
Japan
Prior art keywords
surface wave
elastic surface
type electrode
screen type
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16416378A
Other languages
Japanese (ja)
Other versions
JPS6129147B2 (en
Inventor
Kimio Shibayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP16416378A priority Critical patent/JPS5591852A/en
Publication of JPS5591852A publication Critical patent/JPS5591852A/en
Publication of JPS6129147B2 publication Critical patent/JPS6129147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To make a whole device more compact by forming an elastic surface wave element on a semiconductor substrate whereon a semiconductor device has been formed. CONSTITUTION:A signal is applied to a reed screen type electrode 5 provided on an insulating layer 4 while operating a semiconductor integrated circuit within the area 2. If the signal voltage is applied to the reed screen type electrode 5, a protruded electric field is generated on the reed screen type electrode 5, and an elastic surface wave is induced on the rear surface of an elastic surface wave propagation board 8. The elastic surface wave is propagated along the rear surface of the elastic surface wave propagation board 8 and received by a reed screen type electrode 6 via the protruded electric field, then sent to the semiconductor integrated circuit formed in an area 3 so that the signal is processed.
JP16416378A 1978-12-30 1978-12-30 Hybrid semiconductor device containing elastic surface wave element Granted JPS5591852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16416378A JPS5591852A (en) 1978-12-30 1978-12-30 Hybrid semiconductor device containing elastic surface wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16416378A JPS5591852A (en) 1978-12-30 1978-12-30 Hybrid semiconductor device containing elastic surface wave element

Publications (2)

Publication Number Publication Date
JPS5591852A true JPS5591852A (en) 1980-07-11
JPS6129147B2 JPS6129147B2 (en) 1986-07-04

Family

ID=15787919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16416378A Granted JPS5591852A (en) 1978-12-30 1978-12-30 Hybrid semiconductor device containing elastic surface wave element

Country Status (1)

Country Link
JP (1) JPS5591852A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110375A (en) * 1991-10-17 1993-04-30 Mitsubishi Electric Corp Surface acoustic wave circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110375A (en) * 1991-10-17 1993-04-30 Mitsubishi Electric Corp Surface acoustic wave circuit device

Also Published As

Publication number Publication date
JPS6129147B2 (en) 1986-07-04

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