JPS5588358A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS5588358A JPS5588358A JP15986978A JP15986978A JPS5588358A JP S5588358 A JPS5588358 A JP S5588358A JP 15986978 A JP15986978 A JP 15986978A JP 15986978 A JP15986978 A JP 15986978A JP S5588358 A JPS5588358 A JP S5588358A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- high heat
- heat conductive
- powder
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15986978A JPS5588358A (en) | 1978-12-27 | 1978-12-27 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15986978A JPS5588358A (en) | 1978-12-27 | 1978-12-27 | Resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5588358A true JPS5588358A (en) | 1980-07-04 |
Family
ID=15702983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15986978A Pending JPS5588358A (en) | 1978-12-27 | 1978-12-27 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5588358A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4788583A (en) * | 1986-07-25 | 1988-11-29 | Fujitsu Limited | Semiconductor device and method of producing semiconductor device |
US5296740A (en) * | 1991-03-20 | 1994-03-22 | Fujitsu Limited | Method and apparatus for a semiconductor device having a radiation part |
US6239479B1 (en) * | 1995-04-03 | 2001-05-29 | Texas Instruments Incorporated | Thermal neutron shielded integrated circuits |
-
1978
- 1978-12-27 JP JP15986978A patent/JPS5588358A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4788583A (en) * | 1986-07-25 | 1988-11-29 | Fujitsu Limited | Semiconductor device and method of producing semiconductor device |
US5296740A (en) * | 1991-03-20 | 1994-03-22 | Fujitsu Limited | Method and apparatus for a semiconductor device having a radiation part |
US5424251A (en) * | 1991-03-20 | 1995-06-13 | Fujitsu Limited | Method of producing semiconductor device having radiation part made of resin containing insulator powders |
US6239479B1 (en) * | 1995-04-03 | 2001-05-29 | Texas Instruments Incorporated | Thermal neutron shielded integrated circuits |
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