JPS5588343A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS5588343A
JPS5588343A JP15985678A JP15985678A JPS5588343A JP S5588343 A JPS5588343 A JP S5588343A JP 15985678 A JP15985678 A JP 15985678A JP 15985678 A JP15985678 A JP 15985678A JP S5588343 A JPS5588343 A JP S5588343A
Authority
JP
Japan
Prior art keywords
bonding
unit
tappet
driving unit
wire bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15985678A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15985678A priority Critical patent/JPS5588343A/en
Publication of JPS5588343A publication Critical patent/JPS5588343A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure a high-speed and stable wire bonding by a method wherein a bonding unit and a bonding driving unit are isolated gravimetrically and said unit and driving unit are coupled mechanically by a tappet.
CONSTITUTION: Only a bonding unit 12 is provided on a table 11 moving in the direction of XY on a common base 10, and a bonding driving unit 13 is provided directly on the base other than the table. A tappet 21 sliding vertically is connected to each lever 19 interlocking with a plural cam 18 of the bonding driving unit 13, and its tip is interlocked with the other end of a rocking arm 16 of the bonding unit. Each tappet is supported by a ball bearing 20 so as to slide smoothly, and the lower end of the tappet is wide enough to cover a movement of the bonding unit side in the direction of XY.
COPYRIGHT: (C)1980,JPO&Japio
JP15985678A 1978-12-27 1978-12-27 Wire bonder Pending JPS5588343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15985678A JPS5588343A (en) 1978-12-27 1978-12-27 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15985678A JPS5588343A (en) 1978-12-27 1978-12-27 Wire bonder

Publications (1)

Publication Number Publication Date
JPS5588343A true JPS5588343A (en) 1980-07-04

Family

ID=15702716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15985678A Pending JPS5588343A (en) 1978-12-27 1978-12-27 Wire bonder

Country Status (1)

Country Link
JP (1) JPS5588343A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

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