JPS558044A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS558044A
JPS558044A JP8017578A JP8017578A JPS558044A JP S558044 A JPS558044 A JP S558044A JP 8017578 A JP8017578 A JP 8017578A JP 8017578 A JP8017578 A JP 8017578A JP S558044 A JPS558044 A JP S558044A
Authority
JP
Japan
Prior art keywords
semiconductor element
divisions
bonding
insulated
parasitic capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8017578A
Other languages
Japanese (ja)
Inventor
Kenichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP8017578A priority Critical patent/JPS558044A/en
Publication of JPS558044A publication Critical patent/JPS558044A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make common wire bonding of a plurality of divisions which insulate a bonding pad for connecting a semiconductor element from each other so that parasitic capacity is decreased without increasing said pads in size.
CONSTITUTION: A bonding pad 3 for connecting the electrode 1 of a semiconductor element in an insulated center division and a plurality of matually insulated divisions 5. A common wire bonding is provided on said insulated divisions 5 and connected to said electrode 1 of said semiconductor element. Only said divisions 5 provided with said common bonding are relevant to parasitic capacity, and most of the remainder not. Thus, parasitic capacity is decreased without increasing said bonding pad 3 in size.
COPYRIGHT: (C)1980,JPO&Japio
JP8017578A 1978-06-30 1978-06-30 Semiconductor element Pending JPS558044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8017578A JPS558044A (en) 1978-06-30 1978-06-30 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8017578A JPS558044A (en) 1978-06-30 1978-06-30 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS558044A true JPS558044A (en) 1980-01-21

Family

ID=13711001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8017578A Pending JPS558044A (en) 1978-06-30 1978-06-30 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS558044A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174934A (en) * 1986-01-28 1987-07-31 Mitsubishi Electric Corp Semiconductor device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174934A (en) * 1986-01-28 1987-07-31 Mitsubishi Electric Corp Semiconductor device and manufacture thereof

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