JPS5577151A - Heat treatment device for semiconductor wafer - Google Patents
Heat treatment device for semiconductor waferInfo
- Publication number
- JPS5577151A JPS5577151A JP15089578A JP15089578A JPS5577151A JP S5577151 A JPS5577151 A JP S5577151A JP 15089578 A JP15089578 A JP 15089578A JP 15089578 A JP15089578 A JP 15089578A JP S5577151 A JPS5577151 A JP S5577151A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- heat treatment
- treatment device
- tilted
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To accomplish even treatment by preventing wafers from contacting each other with the heat treatment device tilted by a given angle.
CONSTITUTION: The vertical section 1 of a wafer is tilted by 0.5W20° from the frame base with respect to the plane. As a result, even if the groove 6 of the vertical section 1 is slightly larger in width than a wafer 5. The wafer is tilted in the same direction as the section and thus, groove spaces are maintained equal anywhere on the wafer thereby preventing wafers from contacting each other. In this manner, the wafer can be treated evenly.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15089578A JPS5577151A (en) | 1978-12-05 | 1978-12-05 | Heat treatment device for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15089578A JPS5577151A (en) | 1978-12-05 | 1978-12-05 | Heat treatment device for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5577151A true JPS5577151A (en) | 1980-06-10 |
Family
ID=15506716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15089578A Pending JPS5577151A (en) | 1978-12-05 | 1978-12-05 | Heat treatment device for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5577151A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010280966A (en) * | 2009-06-05 | 2010-12-16 | Toyota Motor Corp | Hardening tool |
-
1978
- 1978-12-05 JP JP15089578A patent/JPS5577151A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010280966A (en) * | 2009-06-05 | 2010-12-16 | Toyota Motor Corp | Hardening tool |
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