JPS5575247A - Semiconductor device package - Google Patents
Semiconductor device packageInfo
- Publication number
- JPS5575247A JPS5575247A JP15032578A JP15032578A JPS5575247A JP S5575247 A JPS5575247 A JP S5575247A JP 15032578 A JP15032578 A JP 15032578A JP 15032578 A JP15032578 A JP 15032578A JP S5575247 A JPS5575247 A JP S5575247A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metallized
- device package
- bearer
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To stabilize the thermal resistance of a semiconductor device package by metallizing gold (Au) merely on the adhesive portion of the semiconductor device of a bearer for connecting electrodes to the semiconductor device to thereby omit the metallized nickel (Ni).
CONSTITUTION: Nickel (Ni) is not metallized but gold (Au) is metallized at 8 on the surface 9 adhered with a semiconductor chip 1 thereto of a bearer 5. Accordingly, no Si-Ni alloy layer is produced between the surface 9 and the chip 1. Thus, even if this semiconductor device is used at high temperature for long term, its thermal resistance is stabilized to hardly occur a fault thereat.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15032578A JPS5575247A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15032578A JPS5575247A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5575247A true JPS5575247A (en) | 1980-06-06 |
Family
ID=15494543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15032578A Pending JPS5575247A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5575247A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996026540A1 (en) * | 1995-02-21 | 1996-08-29 | Japan Energy Corporation | Semiconductor device |
-
1978
- 1978-12-04 JP JP15032578A patent/JPS5575247A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996026540A1 (en) * | 1995-02-21 | 1996-08-29 | Japan Energy Corporation | Semiconductor device |
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