Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP2030077ApriorityCriticalpatent/JPS53105971A/en
Publication of JPS53105971ApublicationCriticalpatent/JPS53105971A/en
PURPOSE: To avoid the element breakage by bonding the element to the substrate utilizing the gold Si eutectic reaction, by securing a product of 0.3 - 1.0 mm2 between the copper substrate thickness at the element bonding part and the length of a side of the exposed main surface.