JPS5575231A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5575231A JPS5575231A JP15035278A JP15035278A JPS5575231A JP S5575231 A JPS5575231 A JP S5575231A JP 15035278 A JP15035278 A JP 15035278A JP 15035278 A JP15035278 A JP 15035278A JP S5575231 A JPS5575231 A JP S5575231A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- gate
- conductive wire
- layer
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To reduce the number of parts by piercing a tubular indulator to guide a gate-conductive wire which constitutes a thyristor, connecting one end of the wire to a gate electrode, positioning the other end of the wire at the outside, and sealing the pierced portion by a metalized layer.
CONSTITUTION: In a tubular insulator 4 having a hole to guide a gate-conductive wire 9 comprising an elastic body, is provided a thyristor element 1 comprisisng a positive electrode 1a as an upper layer, a negative electrode 1b, and a gate electrode 1c as a lower layer. Then, a positive-electrode conductor 2 is fixed to the positive electrode 1a and is supported by the first and second welding rings 6 and 7 which are attached to the top of the insulator 4. One end of the gate-conductive wire 9 is fixed to the gate electrode 1c. Then, the other end of the conductive wire 9 is taken out by way of the hole provided in the insulator 4. The inside of the hole is sealed by a metalized layer 12 comprising an Mo-Ni layer and an Ag-Cu layer. Then, a negative-electrode conductor 3 having a cut-out portion to enclose the central portion of the conductive wire 9 is attached to the electrode 1c and is supported by a diaphragm 5 provided at the bottom of the insulator 4.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15035278A JPS5575231A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15035278A JPS5575231A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5575231A true JPS5575231A (en) | 1980-06-06 |
Family
ID=15495105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15035278A Pending JPS5575231A (en) | 1978-12-04 | 1978-12-04 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5575231A (en) |
-
1978
- 1978-12-04 JP JP15035278A patent/JPS5575231A/en active Pending
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