JPS54154969A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54154969A
JPS54154969A JP6337078A JP6337078A JPS54154969A JP S54154969 A JPS54154969 A JP S54154969A JP 6337078 A JP6337078 A JP 6337078A JP 6337078 A JP6337078 A JP 6337078A JP S54154969 A JPS54154969 A JP S54154969A
Authority
JP
Japan
Prior art keywords
case
diode
assembling
constitution
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6337078A
Other languages
Japanese (ja)
Other versions
JPS5910583B2 (en
Inventor
Tomoyasu Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP6337078A priority Critical patent/JPS5910583B2/en
Publication of JPS54154969A publication Critical patent/JPS54154969A/en
Publication of JPS5910583B2 publication Critical patent/JPS5910583B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To secure assembling of the case for the ultra-high frequency device through an extremely simple constitution. CONSTITUTION:Soldering 4a is applied to the ohmic side of diode 1 by means of case lower part electrode 9 containing strip-line ribbon 8a formed, and a connection is secured via the gold wire between the Schottky barrier side diode of the diode and circular electrode substance 2b. Then dipper-shaped electrode 10 functioning as the case upper part electrode with lead termianl is stacked on circular solder 4b and then heat-bonded with pressure given by the holding tool. Component 3 is a cylindrical ceramics, and lead terminal 10a is a strip-line ribbon. The assembling is facilitated furthermore by bending the roots of ribbon 8a and 10a. With such constitution, the assembling yield is enhanced with minimized effect of the case's floating capacity.
JP6337078A 1978-05-29 1978-05-29 Manufacturing method of semiconductor device Expired JPS5910583B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6337078A JPS5910583B2 (en) 1978-05-29 1978-05-29 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6337078A JPS5910583B2 (en) 1978-05-29 1978-05-29 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS54154969A true JPS54154969A (en) 1979-12-06
JPS5910583B2 JPS5910583B2 (en) 1984-03-09

Family

ID=13227318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6337078A Expired JPS5910583B2 (en) 1978-05-29 1978-05-29 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5910583B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111588U (en) * 1984-12-24 1986-07-15
JPH0315194Y2 (en) * 1985-04-11 1991-04-03

Also Published As

Publication number Publication date
JPS5910583B2 (en) 1984-03-09

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