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1975-05-27 |
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Solderable multilayer contact for silicon semiconductor
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General Motors Corporation |
Evaporated solderable multilayer contact for silicon semiconductor
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1982-03-16 |
1983-09-21 |
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半導体装置
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Multi-element circuit construction
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Matsushita Electric Ind Co Ltd |
半導体装置の製造方法
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1985-09-10 |
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Integrated circuit chip package
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1986-06-26 |
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Toshiba Corp |
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Ford Motor Company |
Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
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Hewlett-Packard Company |
Method and apparatus for solder bumping of printed circuit boards
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1987-06-05 |
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Hitachi Ltd |
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Procede de realisation d'un substrat d'interconnexion permettant de connecter une puce sur un substrat de reception
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1999-02-16 |
International Business Machines Corporation |
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1995-09-20 |
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Method of forming solder bumps onto an integrated circuit device
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Method of forming a die-to-insert permanent connection
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Die-to-insert permanent connection and method of forming
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1996-08-26 |
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