JPS5569256A - Sputtering unit - Google Patents

Sputtering unit

Info

Publication number
JPS5569256A
JPS5569256A JP14033978A JP14033978A JPS5569256A JP S5569256 A JPS5569256 A JP S5569256A JP 14033978 A JP14033978 A JP 14033978A JP 14033978 A JP14033978 A JP 14033978A JP S5569256 A JPS5569256 A JP S5569256A
Authority
JP
Japan
Prior art keywords
magnetic
target
coaxial
permanent magnet
sputtering unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14033978A
Other languages
Japanese (ja)
Inventor
Takashi Misumi
Naokichi Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP14033978A priority Critical patent/JPS5569256A/en
Publication of JPS5569256A publication Critical patent/JPS5569256A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To increase the strength of the magnetic field near the surface of a target so as to form a magnetic film at a high speed, by using a cylindrical permanent magnet, which is magnetzed in the direction perpendicular to the axis, within a target for a sputtering unit of coaxial magnetron type. CONSTITUTION:A gas is introduced to a vacuum vessel, which is evacuated by the combination with an exhausting system to a vacuum of 10<-1>-10<-5>torr. In a sputtering unit, where power is supplied to a coaxial magnetic target 11, a coaxial permanent magnet 22 having a magnetic poles perpendicular to the axis and using the surface as the N-pole, and a coaxial permanent magnet 23 using the surface as the S-pole are arranged alternately. The result is that magnetic domains D, E, F having magnetic lines of force shown by arrows 33-36 are formed on the outer periphery of the target 11. By increasing the length of respective magnets corresponding to the magnetic comains D, E, F, the strength of the magnetic field in the axial direction is increased by means of the target 11 and the magnet of proper sizes.
JP14033978A 1978-11-14 1978-11-14 Sputtering unit Pending JPS5569256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14033978A JPS5569256A (en) 1978-11-14 1978-11-14 Sputtering unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14033978A JPS5569256A (en) 1978-11-14 1978-11-14 Sputtering unit

Publications (1)

Publication Number Publication Date
JPS5569256A true JPS5569256A (en) 1980-05-24

Family

ID=15266521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14033978A Pending JPS5569256A (en) 1978-11-14 1978-11-14 Sputtering unit

Country Status (1)

Country Link
JP (1) JPS5569256A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207575A (en) * 1985-03-11 1986-09-13 Hitachi Ltd Sputtering device
JPS62174374A (en) * 1986-01-24 1987-07-31 Nec Corp Target for sputtering
US8741115B2 (en) 2005-03-16 2014-06-03 Bh5773 Ltd Sputtering devices and methods
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
WO2022244788A1 (en) * 2021-05-20 2022-11-24 大学共同利用機関法人高エネルギー加速器研究機構 Non-evaporable-getter coating device, method for manufacturing non-evaporable-getter-coated container/pipe, and non-evaporable-getter-coated container/pipe

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207575A (en) * 1985-03-11 1986-09-13 Hitachi Ltd Sputtering device
JPH0585632B2 (en) * 1985-03-11 1993-12-08 Hitachi Ltd
JPS62174374A (en) * 1986-01-24 1987-07-31 Nec Corp Target for sputtering
US8741115B2 (en) 2005-03-16 2014-06-03 Bh5773 Ltd Sputtering devices and methods
US9583319B2 (en) 2005-03-16 2017-02-28 Bh5773 Ltd Sputtering devices and methods
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
WO2022244788A1 (en) * 2021-05-20 2022-11-24 大学共同利用機関法人高エネルギー加速器研究機構 Non-evaporable-getter coating device, method for manufacturing non-evaporable-getter-coated container/pipe, and non-evaporable-getter-coated container/pipe

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