JPS5569256A - Sputtering unit - Google Patents
Sputtering unitInfo
- Publication number
- JPS5569256A JPS5569256A JP14033978A JP14033978A JPS5569256A JP S5569256 A JPS5569256 A JP S5569256A JP 14033978 A JP14033978 A JP 14033978A JP 14033978 A JP14033978 A JP 14033978A JP S5569256 A JPS5569256 A JP S5569256A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- target
- coaxial
- permanent magnet
- sputtering unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To increase the strength of the magnetic field near the surface of a target so as to form a magnetic film at a high speed, by using a cylindrical permanent magnet, which is magnetzed in the direction perpendicular to the axis, within a target for a sputtering unit of coaxial magnetron type. CONSTITUTION:A gas is introduced to a vacuum vessel, which is evacuated by the combination with an exhausting system to a vacuum of 10<-1>-10<-5>torr. In a sputtering unit, where power is supplied to a coaxial magnetic target 11, a coaxial permanent magnet 22 having a magnetic poles perpendicular to the axis and using the surface as the N-pole, and a coaxial permanent magnet 23 using the surface as the S-pole are arranged alternately. The result is that magnetic domains D, E, F having magnetic lines of force shown by arrows 33-36 are formed on the outer periphery of the target 11. By increasing the length of respective magnets corresponding to the magnetic comains D, E, F, the strength of the magnetic field in the axial direction is increased by means of the target 11 and the magnet of proper sizes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14033978A JPS5569256A (en) | 1978-11-14 | 1978-11-14 | Sputtering unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14033978A JPS5569256A (en) | 1978-11-14 | 1978-11-14 | Sputtering unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5569256A true JPS5569256A (en) | 1980-05-24 |
Family
ID=15266521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14033978A Pending JPS5569256A (en) | 1978-11-14 | 1978-11-14 | Sputtering unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5569256A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207575A (en) * | 1985-03-11 | 1986-09-13 | Hitachi Ltd | Sputtering device |
JPS62174374A (en) * | 1986-01-24 | 1987-07-31 | Nec Corp | Target for sputtering |
US8741115B2 (en) | 2005-03-16 | 2014-06-03 | Bh5773 Ltd | Sputtering devices and methods |
US9368330B2 (en) | 2014-05-02 | 2016-06-14 | Bh5773 Ltd | Sputtering targets and methods |
WO2022244788A1 (en) * | 2021-05-20 | 2022-11-24 | 大学共同利用機関法人高エネルギー加速器研究機構 | Non-evaporable-getter coating device, method for manufacturing non-evaporable-getter-coated container/pipe, and non-evaporable-getter-coated container/pipe |
-
1978
- 1978-11-14 JP JP14033978A patent/JPS5569256A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207575A (en) * | 1985-03-11 | 1986-09-13 | Hitachi Ltd | Sputtering device |
JPH0585632B2 (en) * | 1985-03-11 | 1993-12-08 | Hitachi Ltd | |
JPS62174374A (en) * | 1986-01-24 | 1987-07-31 | Nec Corp | Target for sputtering |
US8741115B2 (en) | 2005-03-16 | 2014-06-03 | Bh5773 Ltd | Sputtering devices and methods |
US9583319B2 (en) | 2005-03-16 | 2017-02-28 | Bh5773 Ltd | Sputtering devices and methods |
US9368330B2 (en) | 2014-05-02 | 2016-06-14 | Bh5773 Ltd | Sputtering targets and methods |
WO2022244788A1 (en) * | 2021-05-20 | 2022-11-24 | 大学共同利用機関法人高エネルギー加速器研究機構 | Non-evaporable-getter coating device, method for manufacturing non-evaporable-getter-coated container/pipe, and non-evaporable-getter-coated container/pipe |
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