JPS61207575A - Sputtering device - Google Patents

Abstract

PURPOSE:To form films of uniform thickness and quality on both surfaces of a disk and to increase the film forming speed by interposing the disk between two sputtering electrodes having targets and providing sealed magnetic field generating parts into the cavities of cathodes. CONSTITUTION:Magnetic flux generating mechanisms 8 are attached into the cavities 6 of the cathodes 5 attached via inside seals 7 to a supporting shaft 3. The targets 12 are attached to the surfaces of the cathodes 5 facing the disk 2 and outside seals 13 are provided to the outside circumferences thereof by which the sputtering electrodes 1, 1' are assembled. Water conduit pipes 14 are opened to the 1st and 2nd magnetic pole body 10, 11 sides of the targets 12 to cool the targets 12. The disk 2 is supported to the shaft 3 between the electrodes 1 and 1'. Plasma-like ions are accelerated by the high voltage impressed between anodes and the cathodes 5 and collide against the targets 12 when the tunnel-shaped magnetic field distributions are generated in the spaces of the surfaces of the targets 12 facing the disk 2 by the magnetic pole bodies 10, 11. The atoms driven from the targets 12 stick and deposit on the disk 2 and the thin films are formed thereon.

Description

[Detailed description of the invention] [Field of application of the invention] The present invention is a Brenna Magne) 0-type sputtering electric current.

The electrode (hereinafter referred to as sputter electrode) structure is particularly large.

The present invention relates to a sputter electrode structure having a configuration suitable for simultaneously forming a thin film on both the front and back surfaces having a large surface area.

[Background of the invention]

Conventionally, there has been a method of forming a thin film using a sputtering electrode on the surface of a so-called donut-shaped disk having a large area and a cavity in the center, such as a magnetic disk. difference.

There is something that was lost. However, in the above method, next.

It includes the problems mentioned above.

(b) Opening area of the shutter relative to the surface area of the disc.

is a part of that, so the film formation efficiency on the disk decreases by 1°.

(b) Total surface area of the disk through the opening of the shutter.

A circular plate or shutter to form a film on the body.

Since it needs to be rotated, the configuration becomes complicated.

(/9 Judging from the configuration shown in Figures 1 and 2, the disk, shutter, and target are separate.

Since it is positioning, it is a structure for positioning.

The configuration may be complex and may not be easy to operate. 10 [Object of the Invention] The present invention solves the above-mentioned conventional problems; it simultaneously processes both the front and back sides of a disc with a simple structure.

It is an object of the present invention to provide a sputter electrode structure that can make the film thickness distribution and quality uniform and improve the film formation speed.

[Summary of the Invention] In order to achieve the above-mentioned objects, the present invention provides a sputtering method for sputtering between two sputtering electrodes, each having a target.

A thin film is applied to both the front and back sides of the disc at the same time without rotating the disc or target by 2 degrees.

In addition, the above-mentioned support shaft penetrates through the center of the two sputter electrodes.

It is supported at the center of the disk to enable positioning of the center of the disk and the two sputtering electrodes, and the top is adjusted according to the size of the disk and the desired film distribution.

Support the distance between the two targets and the disc as shown above.

It is characterized by being able to be selected as appropriate by placing it on the axis.

It is something that

The present invention includes a target formed from a sputtered material and supports the target on a surface.

and a cathode having a cylindrical cavity opening to the surface thereof, and a cathode supported within the cavity of the cathode.

and a magnetic field generating section that generates a tunnel-like magnetic field on the surface of the target, and a shield disposed in a space above the surface of the target.

In the sputter electrode, there is a through hole in the center.

an opening in the surface supporting the target;

A ring-shaped cavity is formed around the through hole.

A ring-shaped magnetic field generating portion supported by 1° within the cavity of the cathode is provided, and is located in a space above the inner circumferential portion of the surface of the target.

An inner shield is provided to be inserted into the through-hole.

It is located in the space above the outer periphery of the surface of the target.

Further, the sputter electrodes are provided at intervals such that the targets face each other, and these sputter electrodes are disposed at intervals so that the targets face each other.

The present invention is characterized in that a medium to be sputtered is provided between the electrodes, and a support shaft is provided that penetrates the center of the sputtering electrode and supports the middle ten cores of the medium. Furthermore, the sputtering electrode is formed with a cathode having a hole in the center thereof, an opening in the surface supporting the target, and a ring-shaped cavity formed around the through hole; a ring-shaped magnetic field generating section supported within the five cavities of the cathode;

It is located in the space above the inner circumference of the surface of the target.

The inner shield is inserted into the penetration hole as shown in FIG.

the outer shield and force supported on the cathode as described above).

It is characterized by being constructed from

[Embodiments of the invention]

The following will explain the embodiments of the present invention with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of a sputter electrode structure showing one embodiment of the present invention, and FIG. 2 is a sectional view showing another example of the sputter electrode structure.

be. In Figure 1, 1 and 1 represent two subas.

The vine electrodes are formed symmetrically with intervals. 2 is the above two spatters along the disk.

A sieve is inserted between the electrodes 1 and 1. 3 is the support shaft,
The through hole 1 tllA formed in the center of the two sputter electrodes 1 and 1' is penetrated, and the two center hubs 4 pass through both the front and back surfaces of the disk 2. I support it as if I were inserting it. The above-mentioned two splinter-shaped electrodes 1, 1 are symmetrical to each other and have a structure 15 described below. 5 is a cathode and is formed into a cylindrical shape.

at its center in the axial direction of the support shaft 3.

Through-holes 1a and i'a are formed to pass through the disk 2.

A ring-shaped cavity 6 is formed that opens on the opposing surface.

There is. 7 is an inner seal, and the above-mentioned through holes 1a, . . . 1
] Shaft part 74 inserted between 1cL and support shaft 3.

A target, which will be described later, is attached to the end of the shaft portion 74 on the disk 2 side.

As if inserted between the inner peripheral portion and the disk 2.

The present invention is attached to the fixed inner seal portion 7b and the other end.

A flange portion 70 for holding the entire device in an insertion sealed container (not shown) is fixed. 8 is magnetic flux.

The generating mechanism is inserted and supported within the cavity 6.

The yoke 9 is a ring-shaped flat plate.

The inner peripheral portion of the yoke 9 is formed of a soft material.

a first magnetic pole body 10 in contact with a ring-shaped permanent member 1')
It is formed of a magnet and is attached to the outer periphery of the yoke 9.

It is formed from the second magnetic pole body 11 in contact with the target 1.
20 so as to generate a tunnel-like distribution of magnetic lines of force (not shown) in the space on the opposing surface of the disc 2. 12 is the target, Ajl-2%Si (purity “99.99
%) is formed into a ring shape and is supported by the disk facing surfaces 1b, 1b of the cathode 5. 13° is an outer seal, which is supported by the cathode 5 through an insulating layer plate (not shown) so as to be inserted between the outer periphery of the target 12 and the disc 2. There is. Reference numeral 14 designates a water conductor, which is supported through the cathode 5 and the yoke 9 in the axial direction, and its tip portion is connected to the first and second portions of the target 12.
Magnetic pole body 1o.

The target 12 is cooled by water jetting out from the opening of the water conduit 14. Because of the above configuration, the cavity 6 of the cathode 5
Attach the magnetic flux generation mechanism 8 inside and penetrate it.

Place the inner seal 7 in the hole 1cL1a on the surface facing the disk 20.

Attach the target 12 to 1b and 1b, and attach it to the outer periphery.

Install the outer seal 13 and connect the two sputter electrodes 1.
Assemble 1'. Next, after arranging the assembled two splinter/vine electrodes 1, 1 at a distance so that their targets 12 face each other, the above-mentioned through/through icL,
The support shaft 3 is passed through the inside of the disk 2, and the disk 2 is placed at the center position between these two sputter electrodes 1.1', with an angle of 1°.
is supported by two center hubs 4.

11] Supported by 3. Next, there are two sputtering chambers.

Place the poles 1 and 1' on the support shaft 5 and move them to the target.

If you adjust the distance between the cut 12 and the disc 2, you can get two pieces.

The center position of the sputter electrodes 1, 1' and the disk 2 is set at -7
,.

7. It is possible to position the target 12 and adjust the distance between the target 12 and the disc 2. Next, the target 12 is formed by the first magnetic pole body 10 and the second magnetic pole body 11 .

A tunnel-shaped magnetic field is created in the space on the opposing surface of disk 2.

When this occurs, plasma ions are accelerated by the high voltage applied between the anode (not shown) and the cathode 5 and collide with the target 12.

Ru. Therefore, the material forming the target 12 is ejected by the colliding plasma ions.

The constituent atoms or particles of the material push out from the target 12 by 1" and are deposited on the disk 2 to form a thin film of the material of the target 12. Next, in FIG. 2, 13 is a magnetic flux generating mechanism. Then, York 14 and this.

a ring-shaped first magnetic pole body 15 made of soft magnetic material 4 that is in contact with the inner circumference of the end surface of the yoke 14;

a second magnetic pole body 16 made of magnetic material 4;
The magnetic pole body 15 and the sixth magnetic pole body 17 made of a ring-shaped soft magnetic material disposed between the second magnetic pole bodies 16 are positioned so that they are in the same center position with respect to each other. Coils 18α and 18b are provided between the magnetic pole bodies 15, 16, and 17 to excite them.

. Since the parts other than the above are the same as those in FIG. 2, they are indicated by the same reference numerals as in FIG. Because of the above configuration.

The difference in operation between this embodiment and the embodiment shown in FIG. 1 is in the first magnetic pole body 1o and the second magnetic pole body 16.

Both magnetic fluxes can be controlled simultaneously. Others.

The process leading to the generation of the lasma region is the same as the above example.

It's the same.

[Effects of the invention] 1.
Since the present invention is as described above, the front and back surfaces of a disk (medium) to be sputtered can be formed using a simple structure.

A thin film can be formed on both sides at the same time, and the aperture ratio is 15.
Approximately 6% compared to when using a conventional shield
It is possible to obtain a film formation rate seven times faster.

Also, since the film is formed on both the front and back sides of the disc at the same time,

This allows you to equalize the stress on the disc.

This can prevent distortion from occurring. difference.

Furthermore, the middle and upper positions of the disk and sputtering electrode can be easily adjusted.

It can be positioned, and the distance between the target and the circle/plate can be selected appropriately by placing it on the support shaft while maintaining the center position of both, which has the effect of making operation extremely easy. .

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a sputter electrode/structure showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing another embodiment of the sputter electrode.・1.1'...Sputter electrode 2...Disk 3...Support shaft 11:4
... Center hub 5 ... Cathode 6 ... Cavity 7 ... Inner seal 8.13 - ... Magnetic flux generation mechanism 1.
. 9.14-Yoke 10.15-...First magnetic pole body 11, i6...Second magnetic pole body 12...Target 13...Outer seal 2°.
11・ 14'...Water conductor 17...Third magnetic pole body 186L, 18b...Coil (・ゝ

Claims (1)

[Claims] 1. A cylinder, a ring-shaped target arranged around the cylinder and made of a material to be sputtered, and a plurality of magnetic field generators that generate a magnetic field to confine plasma on the target surface. means disposed axially symmetrically about the central axis of the cylinder; a tube for introducing liquid for cooling the magnetic field generating means; a cathode supporting the target and the magnetic field generating means; and a region near the outer periphery of the target. A sputtering apparatus 2 having a sputtering electrode structure comprising a shield disposed in the cylinder, and a sputtering apparatus according to claim 1, wherein the sputtering electrode structures are arranged facing each other so that the central axis of the cylinder coincides with the sputtering electrode structure. and a sputtering apparatus in which an object to be sputtered and film-formed is placed in the gap by a shaft penetrating inside the cylinder.