WO2002041356A3 - Sputter cathode with magnetic shunt - Google Patents

Sputter cathode with magnetic shunt Download PDF

Info

Publication number
WO2002041356A3
WO2002041356A3 PCT/NL2001/000821 NL0100821W WO0241356A3 WO 2002041356 A3 WO2002041356 A3 WO 2002041356A3 NL 0100821 W NL0100821 W NL 0100821W WO 0241356 A3 WO0241356 A3 WO 0241356A3
Authority
WO
WIPO (PCT)
Prior art keywords
axis
electromagnet
pole
target
sputter cathode
Prior art date
Application number
PCT/NL2001/000821
Other languages
French (fr)
Other versions
WO2002041356A2 (en
Inventor
Jeroen Franciscus Landsbergen
Jiri Vyskocil
Original Assignee
Otb Group Bv
Jeroen Franciscus Landsbergen
Jiri Vyskocil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Group Bv, Jeroen Franciscus Landsbergen, Jiri Vyskocil filed Critical Otb Group Bv
Priority to EP01996878A priority Critical patent/EP1364385A2/en
Priority to AU2002221201A priority patent/AU2002221201A1/en
Publication of WO2002041356A2 publication Critical patent/WO2002041356A2/en
Publication of WO2002041356A3 publication Critical patent/WO2002041356A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Abstract

Sputter cathode (1) with a target (8) around an axis and a number of permanent magnets provided around the axis. The permanent magnets produce a tunnel shaped radially oriented magnetic field in the vicinity of the surface of the target to be sputtered. Further an electromagnet (24) with a yoke and first and second poles produces an axially oriented magnetic field along the axis. The first pole is located nearer to the axis than the electromagnet and the second pole is located further of the axis than the electromagnet. A magnetic shunt (25) is provided in the axial direction between the electromagnet and the target and in the radial direction between the axis and the second pole.
PCT/NL2001/000821 2000-11-13 2001-11-13 Sputter cathode with magnetic shunt WO2002041356A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01996878A EP1364385A2 (en) 2000-11-13 2001-11-13 Sputter cathode with magnetic shunt
AU2002221201A AU2002221201A1 (en) 2000-11-13 2001-11-13 Sputter cathode with magnetic shunt

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1016597 2000-11-13
NL1016597A NL1016597C2 (en) 2000-11-13 2000-11-13 Sputter cathode with magnetic shunt.

Publications (2)

Publication Number Publication Date
WO2002041356A2 WO2002041356A2 (en) 2002-05-23
WO2002041356A3 true WO2002041356A3 (en) 2003-09-18

Family

ID=19772379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2001/000821 WO2002041356A2 (en) 2000-11-13 2001-11-13 Sputter cathode with magnetic shunt

Country Status (5)

Country Link
EP (1) EP1364385A2 (en)
AU (1) AU2002221201A1 (en)
NL (1) NL1016597C2 (en)
TW (1) TW556247B (en)
WO (1) WO2002041356A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030058332A (en) * 2001-12-31 2003-07-07 엘지.필립스 엘시디 주식회사 A sputtering apparatus
TWI766707B (en) * 2021-05-28 2022-06-01 天虹科技股份有限公司 Magnetic apparatus and thin film deposition equipment for adjusting magnetic field distribution
CN115404449B (en) * 2021-05-28 2023-12-01 鑫天虹(厦门)科技有限公司 Thin film deposition equipment capable of adjusting magnetic field distribution and magnetic field adjusting device thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3908252A1 (en) * 1989-03-14 1990-09-20 Leybold Ag Sputtering cathode employing the magnetron principle
US5685959A (en) * 1996-10-25 1997-11-11 Hmt Technology Corporation Cathode assembly having rotating magnetic-field shunt and method of making magnetic recording media
US5876576A (en) * 1997-10-27 1999-03-02 Applied Materials, Inc. Apparatus for sputtering magnetic target materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3908252A1 (en) * 1989-03-14 1990-09-20 Leybold Ag Sputtering cathode employing the magnetron principle
US5685959A (en) * 1996-10-25 1997-11-11 Hmt Technology Corporation Cathode assembly having rotating magnetic-field shunt and method of making magnetic recording media
US5876576A (en) * 1997-10-27 1999-03-02 Applied Materials, Inc. Apparatus for sputtering magnetic target materials

Also Published As

Publication number Publication date
EP1364385A2 (en) 2003-11-26
NL1016597C2 (en) 2002-05-14
AU2002221201A1 (en) 2002-05-27
WO2002041356A2 (en) 2002-05-23
TW556247B (en) 2003-10-01

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