JPS5558541A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5558541A
JPS5558541A JP13137878A JP13137878A JPS5558541A JP S5558541 A JPS5558541 A JP S5558541A JP 13137878 A JP13137878 A JP 13137878A JP 13137878 A JP13137878 A JP 13137878A JP S5558541 A JPS5558541 A JP S5558541A
Authority
JP
Japan
Prior art keywords
fitted
insulating
electrode
flange
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13137878A
Other languages
Japanese (ja)
Other versions
JPS6211498B2 (en
Inventor
Futoshi Tokuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13137878A priority Critical patent/JPS5558541A/en
Publication of JPS5558541A publication Critical patent/JPS5558541A/en
Publication of JPS6211498B2 publication Critical patent/JPS6211498B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To reduce cost and improve reliability, by surrounding both surfaces of a semiconductor element, which is sandwiched by an anode and a cathode, with an insulating elastic body and an insulating cylindrical body.
CONSTITUTION: Cathode external electrode 1 and anode external electrode 5 are fixed to both surfaces of semiconductor element 4, which is a planar diode. Both sides of element 4 are fitted with guide ring 9 made of heat resisting rubber, such as silicone rubber or fluoric rubber. By this, ring 9 is spread by element 4 and is fitted around element 4 by its own elastic force. Next, insulating cylindrical body 2 is fitted to the outer surface of ring 9. On the upper side of these is fitted flange 8, which projects from the end of electrode 1. On the lower surface is fitted flange 6, which projects from the end of electrode 5, via flange 7. By this, the clearance between element and insulating body can be absorbed and positioning can be operated with high precision.
COPYRIGHT: (C)1980,JPO&Japio
JP13137878A 1978-10-24 1978-10-24 Semiconductor device Granted JPS5558541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13137878A JPS5558541A (en) 1978-10-24 1978-10-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13137878A JPS5558541A (en) 1978-10-24 1978-10-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5558541A true JPS5558541A (en) 1980-05-01
JPS6211498B2 JPS6211498B2 (en) 1987-03-12

Family

ID=15056537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13137878A Granted JPS5558541A (en) 1978-10-24 1978-10-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5558541A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837928A (en) * 1981-08-31 1983-03-05 Toshiba Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837928A (en) * 1981-08-31 1983-03-05 Toshiba Corp Semiconductor device
JPH0213813B2 (en) * 1981-08-31 1990-04-05 Tokyo Shibaura Electric Co

Also Published As

Publication number Publication date
JPS6211498B2 (en) 1987-03-12

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