JPS553647A - Pressure contact type semiconductor device - Google Patents

Pressure contact type semiconductor device

Info

Publication number
JPS553647A
JPS553647A JP7559478A JP7559478A JPS553647A JP S553647 A JPS553647 A JP S553647A JP 7559478 A JP7559478 A JP 7559478A JP 7559478 A JP7559478 A JP 7559478A JP S553647 A JPS553647 A JP S553647A
Authority
JP
Japan
Prior art keywords
buffer plate
diameter
ring
rubber ring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7559478A
Other languages
Japanese (ja)
Inventor
Toshinobu Sekiba
Kimihiro Nitta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7559478A priority Critical patent/JPS553647A/en
Publication of JPS553647A publication Critical patent/JPS553647A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To firmly hold a buffer plate between a pellet and an electrode in a semiconductor device, the buffer plate is provided with a larger diameter than the inner diameter of either an inner or outer ring, and deformedly inserted into the ring.
CONSTITUTION: A pellet 2 is flatly held between an upper 4 and lower 6 electrodes through an upper 8a and lower 10 buffer plates, and peripherally enclosed by a cylindrical silicone rubber ring 12. The upper buffer plate 8a has a diameter greater than the inner diameter of the rubber ring 12 and is made of Mo or W plate with a thickness deformable by a load of about a few kg. Therefore, the buffer plate 8a, when inserted into the rubber ring, deforms and always contacts at its periphery with the inner face of the rubber ring 12 so that it is held firmly. Alternately, the buffer plate 8a may have a greater diameter than the inner diameter of a ceramic ring 18 to be held by it.
COPYRIGHT: (C)1980,JPO&Japio
JP7559478A 1978-06-22 1978-06-22 Pressure contact type semiconductor device Pending JPS553647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7559478A JPS553647A (en) 1978-06-22 1978-06-22 Pressure contact type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7559478A JPS553647A (en) 1978-06-22 1978-06-22 Pressure contact type semiconductor device

Publications (1)

Publication Number Publication Date
JPS553647A true JPS553647A (en) 1980-01-11

Family

ID=13580670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7559478A Pending JPS553647A (en) 1978-06-22 1978-06-22 Pressure contact type semiconductor device

Country Status (1)

Country Link
JP (1) JPS553647A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954231A (en) * 1982-09-22 1984-03-29 Toshiba Corp Compression bonding type semiconductor device
US5278434A (en) * 1991-05-30 1994-01-11 Mitsubishi Denki Kabushiki Kaisha Pressure engagement structure for a full press-pack type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954231A (en) * 1982-09-22 1984-03-29 Toshiba Corp Compression bonding type semiconductor device
US5278434A (en) * 1991-05-30 1994-01-11 Mitsubishi Denki Kabushiki Kaisha Pressure engagement structure for a full press-pack type semiconductor device

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