JPS553647A - Pressure contact type semiconductor device - Google Patents
Pressure contact type semiconductor deviceInfo
- Publication number
- JPS553647A JPS553647A JP7559478A JP7559478A JPS553647A JP S553647 A JPS553647 A JP S553647A JP 7559478 A JP7559478 A JP 7559478A JP 7559478 A JP7559478 A JP 7559478A JP S553647 A JPS553647 A JP S553647A
- Authority
- JP
- Japan
- Prior art keywords
- buffer plate
- diameter
- ring
- rubber ring
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To firmly hold a buffer plate between a pellet and an electrode in a semiconductor device, the buffer plate is provided with a larger diameter than the inner diameter of either an inner or outer ring, and deformedly inserted into the ring.
CONSTITUTION: A pellet 2 is flatly held between an upper 4 and lower 6 electrodes through an upper 8a and lower 10 buffer plates, and peripherally enclosed by a cylindrical silicone rubber ring 12. The upper buffer plate 8a has a diameter greater than the inner diameter of the rubber ring 12 and is made of Mo or W plate with a thickness deformable by a load of about a few kg. Therefore, the buffer plate 8a, when inserted into the rubber ring, deforms and always contacts at its periphery with the inner face of the rubber ring 12 so that it is held firmly. Alternately, the buffer plate 8a may have a greater diameter than the inner diameter of a ceramic ring 18 to be held by it.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7559478A JPS553647A (en) | 1978-06-22 | 1978-06-22 | Pressure contact type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7559478A JPS553647A (en) | 1978-06-22 | 1978-06-22 | Pressure contact type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS553647A true JPS553647A (en) | 1980-01-11 |
Family
ID=13580670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7559478A Pending JPS553647A (en) | 1978-06-22 | 1978-06-22 | Pressure contact type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS553647A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954231A (en) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | Compression bonding type semiconductor device |
US5278434A (en) * | 1991-05-30 | 1994-01-11 | Mitsubishi Denki Kabushiki Kaisha | Pressure engagement structure for a full press-pack type semiconductor device |
-
1978
- 1978-06-22 JP JP7559478A patent/JPS553647A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954231A (en) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | Compression bonding type semiconductor device |
US5278434A (en) * | 1991-05-30 | 1994-01-11 | Mitsubishi Denki Kabushiki Kaisha | Pressure engagement structure for a full press-pack type semiconductor device |
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