JPS5599730A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5599730A
JPS5599730A JP799179A JP799179A JPS5599730A JP S5599730 A JPS5599730 A JP S5599730A JP 799179 A JP799179 A JP 799179A JP 799179 A JP799179 A JP 799179A JP S5599730 A JPS5599730 A JP S5599730A
Authority
JP
Japan
Prior art keywords
electrode
pellet
principal face
face
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP799179A
Other languages
Japanese (ja)
Inventor
Toshinori Nishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP799179A priority Critical patent/JPS5599730A/en
Publication of JPS5599730A publication Critical patent/JPS5599730A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To secure a good contact state in a semiconductor device which has a swollen electrode on one principal face and a metal electrode pressure welded to an external electrode on the other principal face, by making the cross-sectional shape of the electrode on the other principal face into a convex shape.
CONSTITUTION: A semiconductor pellet 6 has a surface electrode 1 and a back face electrode 2 which are pressure welded to external electrodes 3 and 3' of gold, silver, etc. As the pellet 6 has a distant part 5, if a peeling phenomenon occurs on the back face electrode in the separation process of the semiconductor pellet, the space 5 absorbs it, therefore, the contact state of the pellet 6 with the external electrode 3 is kept in a good state.
COPYRIGHT: (C)1980,JPO&Japio
JP799179A 1979-01-25 1979-01-25 Semiconductor device Pending JPS5599730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP799179A JPS5599730A (en) 1979-01-25 1979-01-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP799179A JPS5599730A (en) 1979-01-25 1979-01-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5599730A true JPS5599730A (en) 1980-07-30

Family

ID=11680867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP799179A Pending JPS5599730A (en) 1979-01-25 1979-01-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5599730A (en)

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