JPS5546564A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5546564A
JPS5546564A JP12065078A JP12065078A JPS5546564A JP S5546564 A JPS5546564 A JP S5546564A JP 12065078 A JP12065078 A JP 12065078A JP 12065078 A JP12065078 A JP 12065078A JP S5546564 A JPS5546564 A JP S5546564A
Authority
JP
Japan
Prior art keywords
disk
solder
gold
molybdenum
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12065078A
Other languages
Japanese (ja)
Inventor
Makoto Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP12065078A priority Critical patent/JPS5546564A/en
Publication of JPS5546564A publication Critical patent/JPS5546564A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent solder from creeping on a semiconductor device without surface treatment on the side surface of a metallic disk for absorbing thermal expansion difference.
CONSTITUTION: Gold 11 is superimposed on only the upper and lower surfaces of molybdenum disk 9 of base nickel 10. This disk 9 is soldered at 12 to a dischrge plate 8, and secured to a semiconductor 7 with gold and silicon eutectic solder 13. According to this configuration, molybdenum is exposed on the side surface of the disk 9 to be improperly wettable with solder 12 to thereby prevent the solder 12 from creeping onto the disk 9. Accordingly, it can readily and exactly adhere with high reliability.
COPYRIGHT: (C)1980,JPO&Japio
JP12065078A 1978-09-29 1978-09-29 Semiconductor device Pending JPS5546564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12065078A JPS5546564A (en) 1978-09-29 1978-09-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12065078A JPS5546564A (en) 1978-09-29 1978-09-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5546564A true JPS5546564A (en) 1980-04-01

Family

ID=14791470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12065078A Pending JPS5546564A (en) 1978-09-29 1978-09-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5546564A (en)

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