JPS5541786A - Method of forming metal image - Google Patents

Method of forming metal image

Info

Publication number
JPS5541786A
JPS5541786A JP11609278A JP11609278A JPS5541786A JP S5541786 A JPS5541786 A JP S5541786A JP 11609278 A JP11609278 A JP 11609278A JP 11609278 A JP11609278 A JP 11609278A JP S5541786 A JPS5541786 A JP S5541786A
Authority
JP
Japan
Prior art keywords
partitions
image
width
etching
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11609278A
Other languages
Japanese (ja)
Inventor
Mitsumasa Umezaki
Hiroshi Sugawara
Tatsuo Ozeki
Hiroshi Tottori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11609278A priority Critical patent/JPS5541786A/en
Publication of JPS5541786A publication Critical patent/JPS5541786A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide the subject method comprising the steps of: providing partitions consisting of photoresists the intervals of which are defined on the substrate, applying metal films on the partitioned regions, and removing by etching metal films in the unnecessary partitions while masking the partitioned regions with the resists thereby to obtain a fine metal wiring.
CONSTITUTION: If the substrate 1 is made of a material unable to be electroplated, a plated layer 2 which becomes a surface layer is firstly applied thereon, and there are formed thereon partitions 7 consisting of plating photoresist images having a width d of less than 10μm at an interval of l the same as the width t of the fine image 5 formed subsequently. Then, while the layer 2 encircled by partitions 7 is subjected to photoresist coat plating to form the metal film 3, the film 3 is divided into two parts 3a and 3b without adhering to the partitions 7. Thereafter, an etching photoresist image 8 containing the upper parts of partitions 7 at both sides are removed by etching using the image 8 as a mask. Then, the partitions 7 and the image 8 are removed, and only the fine image 5 having the width t being caused to remain at the central part.
COPYRIGHT: (C)1980,JPO&Japio
JP11609278A 1978-09-19 1978-09-19 Method of forming metal image Pending JPS5541786A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11609278A JPS5541786A (en) 1978-09-19 1978-09-19 Method of forming metal image

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11609278A JPS5541786A (en) 1978-09-19 1978-09-19 Method of forming metal image

Publications (1)

Publication Number Publication Date
JPS5541786A true JPS5541786A (en) 1980-03-24

Family

ID=14678504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11609278A Pending JPS5541786A (en) 1978-09-19 1978-09-19 Method of forming metal image

Country Status (1)

Country Link
JP (1) JPS5541786A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5095147A (en) * 1973-12-20 1975-07-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5095147A (en) * 1973-12-20 1975-07-29

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