JPS553633A - Manufacturing semiconductor device - Google Patents
Manufacturing semiconductor deviceInfo
- Publication number
- JPS553633A JPS553633A JP7500678A JP7500678A JPS553633A JP S553633 A JPS553633 A JP S553633A JP 7500678 A JP7500678 A JP 7500678A JP 7500678 A JP7500678 A JP 7500678A JP S553633 A JPS553633 A JP S553633A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sides
- diffusion
- electrode
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
Abstract
PURPOSE: To obtain solar cells having excellent characteristics in the low illumination-intensity environment by cutting the diffusion layer formed on the surface and the sides of a semiconductor substrate at the edge of outer peripheral of the substrate by mechanical abrasing or chemical etching.
CONSTITUTION: A doped oxide film 2 is coated on the surface and the sides of an Si substrate 1 and heat treatment is made. Then, diffusion layers 3 and 3" are formed on the surface and sides, respectively, and at the same time a thin diffusion layer 3' is formed on the back. Then, with the film 2 which is condensed by the diffusion treatment remained, the peripheral edge 4 is mechanically or chemically removed so that the connection between diffusion layers 3 and 3" is cut out, and a processed alteration layer 5 caused on the edge 4 is removed by immersing it in an etching tank 7 containing NaOH solution 6. Then the film 2 is removed, and a surface electrode 8 comprising Ti, Pd, and Ag is attached to the surface, and a back electrode 9 comprising Ti, Pd, and Ag is attached to the back if the substrate 1 is P type. Then heat treatment is made to diffuse Al of the electrode 9, and a P+ type layer 10 is provided.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7500678A JPS553633A (en) | 1978-06-20 | 1978-06-20 | Manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7500678A JPS553633A (en) | 1978-06-20 | 1978-06-20 | Manufacturing semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS553633A true JPS553633A (en) | 1980-01-11 |
JPS5757860B2 JPS5757860B2 (en) | 1982-12-07 |
Family
ID=13563671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7500678A Granted JPS553633A (en) | 1978-06-20 | 1978-06-20 | Manufacturing semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS553633A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02100319A (en) * | 1988-10-07 | 1990-04-12 | Fujitsu Ltd | Manufacture of semiconductor device |
EP0625803A1 (en) * | 1993-05-19 | 1994-11-23 | Hewlett-Packard GmbH | Photodiode structure |
WO2008093488A1 (en) * | 2007-01-31 | 2008-08-07 | Shin-Etsu Handotai Co., Ltd. | Silicon wafer beveling device, silicon wafer manufacturing method, and etched silicon wafer |
JP2010232466A (en) * | 2009-03-27 | 2010-10-14 | Sanyo Electric Co Ltd | Solar cell module |
-
1978
- 1978-06-20 JP JP7500678A patent/JPS553633A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02100319A (en) * | 1988-10-07 | 1990-04-12 | Fujitsu Ltd | Manufacture of semiconductor device |
EP0625803A1 (en) * | 1993-05-19 | 1994-11-23 | Hewlett-Packard GmbH | Photodiode structure |
US5430321A (en) * | 1993-05-19 | 1995-07-04 | Hewlett-Packard Company | Photodiode structure |
WO2008093488A1 (en) * | 2007-01-31 | 2008-08-07 | Shin-Etsu Handotai Co., Ltd. | Silicon wafer beveling device, silicon wafer manufacturing method, and etched silicon wafer |
US8454852B2 (en) | 2007-01-31 | 2013-06-04 | Shin-Etsu Handotai Co., Ltd. | Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer |
JP2010232466A (en) * | 2009-03-27 | 2010-10-14 | Sanyo Electric Co Ltd | Solar cell module |
Also Published As
Publication number | Publication date |
---|---|
JPS5757860B2 (en) | 1982-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2962394A (en) | Process for plating a silicon base semiconductive unit with nickel | |
JPS57113264A (en) | Manufacture of mis type capacitor | |
IE822564L (en) | Fabrication a semiconductor device having a phosphosilicate glass layer | |
JPS553633A (en) | Manufacturing semiconductor device | |
US3145126A (en) | Method of making diffused junctions | |
JPS6088481A (en) | Solar battery | |
JPS5579447A (en) | Photomask substrate and photomask | |
JPS5331983A (en) | Production of semiconductor substrates | |
JPS54109765A (en) | Manufacture of semiconductor device | |
JPS52124860A (en) | Electrode formation method for semiconductor devices | |
JPS5544772A (en) | Manufacture of semiconductor | |
JPS54101687A (en) | Solar battery unit | |
KR930015137A (en) | Solar cell manufacturing method | |
JPS5638863A (en) | Semiconductor device | |
JPS5780768A (en) | Semiconductor device | |
JPS5541751A (en) | Manufacturing semiconductor device | |
JPS5633855A (en) | Semiconductor device and its manufacture | |
JPS5487470A (en) | Manufacture of semiconductor device | |
JPS5346272A (en) | Impurity diffusion method | |
JPS5565435A (en) | Preparation of semiconductor device | |
JPS538081A (en) | Production of semiconductor device | |
JPS5471562A (en) | Semiconductor element | |
JPS54101666A (en) | Semiconductor device | |
JPS5792872A (en) | Diode | |
JPS5464474A (en) | Manufacture for semiconductor device |