JPS5487470A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5487470A
JPS5487470A JP15581377A JP15581377A JPS5487470A JP S5487470 A JPS5487470 A JP S5487470A JP 15581377 A JP15581377 A JP 15581377A JP 15581377 A JP15581377 A JP 15581377A JP S5487470 A JPS5487470 A JP S5487470A
Authority
JP
Japan
Prior art keywords
film
electrode
layer
substrate
unneeded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15581377A
Other languages
Japanese (ja)
Inventor
Misao Saga
Akira Amano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP15581377A priority Critical patent/JPS5487470A/en
Publication of JPS5487470A publication Critical patent/JPS5487470A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To obtain an electrode which is mechanically and chemically stable by stacking a Cr layer as a contact metal layer and Au thin film on a semiconductor- substrate electrode part, by providing an Ag protruding electrode on it by electrolytic plating and by removing unneeded parts of the Au thin film and Cr by etching.
CONSTITUTION: Onto N-type Si substrate 1, SiO2 film 2 is adhered and after a window is made, P-type region 4 is formed in exposed substrate 1 through diffusion. Next, film 2 generated in one is provided with window 3 for an electrode to expose one part of region 4, the Cr layer 5 and thin Au film 6 are vapor-deposited on the entire surface by being stacked. Then, reverse-surface electrode 7 is provided onto the reverse surface of substrate 1 and the unneeded part of film 6 is removed by photoetching. Next, photo resists film 8 is applied here and electrolytic plating is done over a protecting of layer 5, thereby forming Ag protruding electrode 9 in a hemisphere shape on film 6. Then' unneeded parts of film 8 and layer 5 are removed.
COPYRIGHT: (C)1979,JPO&Japio
JP15581377A 1977-12-24 1977-12-24 Manufacture of semiconductor device Pending JPS5487470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15581377A JPS5487470A (en) 1977-12-24 1977-12-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15581377A JPS5487470A (en) 1977-12-24 1977-12-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5487470A true JPS5487470A (en) 1979-07-11

Family

ID=15614024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15581377A Pending JPS5487470A (en) 1977-12-24 1977-12-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5487470A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688339A (en) * 1979-12-21 1981-07-17 Hitachi Ltd Dhd-sealed semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919631A (en) * 1972-06-14 1974-02-21
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919631A (en) * 1972-06-14 1974-02-21
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688339A (en) * 1979-12-21 1981-07-17 Hitachi Ltd Dhd-sealed semiconductor device
JPS6346984B2 (en) * 1979-12-21 1988-09-20 Hitachi Ltd

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