JPS5531141A - Pretreatment method of brazing filler metal substrate for electroforming - Google Patents
Pretreatment method of brazing filler metal substrate for electroformingInfo
- Publication number
- JPS5531141A JPS5531141A JP10365578A JP10365578A JPS5531141A JP S5531141 A JPS5531141 A JP S5531141A JP 10365578 A JP10365578 A JP 10365578A JP 10365578 A JP10365578 A JP 10365578A JP S5531141 A JPS5531141 A JP S5531141A
- Authority
- JP
- Japan
- Prior art keywords
- electroforming
- metal substrate
- filler metal
- brazing filler
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title abstract 3
- 238000005323 electroforming Methods 0.000 title abstract 3
- 239000000945 filler Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000002203 pretreatment Methods 0.000 title 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 abstract 6
- -1 aliphatic chlorine compound Chemical class 0.000 abstract 3
- 238000007598 dipping method Methods 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 2
- 238000007772 electroless plating Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 abstract 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005034 decoration Methods 0.000 abstract 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Natural products CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229960003750 ethyl chloride Drugs 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365578A JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365578A JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5531141A true JPS5531141A (en) | 1980-03-05 |
| JPS6146554B2 JPS6146554B2 (enrdf_load_stackoverflow) | 1986-10-15 |
Family
ID=14359787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10365578A Granted JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531141A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6128434A (ja) * | 1984-07-19 | 1986-02-08 | Nippon Paint Co Ltd | 分散安定剤とその使用 |
| JPS63203774A (ja) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | 非電導性物質への無電解メツキ方法 |
-
1978
- 1978-08-25 JP JP10365578A patent/JPS5531141A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6128434A (ja) * | 1984-07-19 | 1986-02-08 | Nippon Paint Co Ltd | 分散安定剤とその使用 |
| JPS63203774A (ja) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | 非電導性物質への無電解メツキ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6146554B2 (enrdf_load_stackoverflow) | 1986-10-15 |
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