JPS5530823A - Mask-wafer gap setting device - Google Patents

Mask-wafer gap setting device

Info

Publication number
JPS5530823A
JPS5530823A JP10349978A JP10349978A JPS5530823A JP S5530823 A JPS5530823 A JP S5530823A JP 10349978 A JP10349978 A JP 10349978A JP 10349978 A JP10349978 A JP 10349978A JP S5530823 A JPS5530823 A JP S5530823A
Authority
JP
Japan
Prior art keywords
mask
gap
wafer
stage
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10349978A
Other languages
Japanese (ja)
Other versions
JPS5616545B2 (en
Inventor
Toshiyuki Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10349978A priority Critical patent/JPS5530823A/en
Publication of JPS5530823A publication Critical patent/JPS5530823A/en
Publication of JPS5616545B2 publication Critical patent/JPS5616545B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To improve the uniformity of a gap between a mask and a stage and the accuracy of the gap by calibrating gap measuring elements provided three or more contacting the mask to the stage which moves with no friction.
CONSTITUTION: When a wafer supporting stage 13 is raised with a fine vertical moving mechanism 18 and is contacted to a mask 20, a spring plate 11 is deformed and the mask 20 contacts with a wafer 15 all over the surface, as the projection 14 of the stage 13 is supported by the spring plate 11. Next, the zero points of gap measuring elements 16 are calibrated, the wafer 15 is separated from the mask 20, and after the spring 11 restored from the deformation, the gap and inclination between the mask 20 and the wafer 15 are measured obtaining measuring values with the gap measuring elements 16. Next, after correcting the inclination with a fine inclination adjusting mechanism 17 to make the mask and the wafer parallel, the gap is adjusted with the fine vertical moving mechanism 18. By so doing, the gap can ce set with high accuracy.
COPYRIGHT: (C)1980,JPO&Japio
JP10349978A 1978-08-25 1978-08-25 Mask-wafer gap setting device Granted JPS5530823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10349978A JPS5530823A (en) 1978-08-25 1978-08-25 Mask-wafer gap setting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10349978A JPS5530823A (en) 1978-08-25 1978-08-25 Mask-wafer gap setting device

Publications (2)

Publication Number Publication Date
JPS5530823A true JPS5530823A (en) 1980-03-04
JPS5616545B2 JPS5616545B2 (en) 1981-04-16

Family

ID=14355670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10349978A Granted JPS5530823A (en) 1978-08-25 1978-08-25 Mask-wafer gap setting device

Country Status (1)

Country Link
JP (1) JPS5530823A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164550U (en) * 1980-05-08 1981-12-07
JPS56164549U (en) * 1980-05-08 1981-12-07
JPS5712743U (en) * 1980-06-23 1982-01-22
JPS5847447A (en) * 1981-09-17 1983-03-19 Riken Vitamin Co Ltd Feed for fry
US4397078A (en) * 1980-08-11 1983-08-09 Telmec Co., Ltd. Method and apparatus for measuring a gap distance between a mask and a wafer to be used in fabrication of semiconductor integrated circuits
JPS58175631U (en) * 1982-05-18 1983-11-24 株式会社東芝 parallelization device
JPH0195732A (en) * 1987-10-06 1989-04-13 Nippon Suisan Kaisha Ltd Feed for fish and shellfish
JP2013120789A (en) * 2011-12-06 2013-06-17 National Institute Of Advanced Industrial & Technology Exposure system

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144428Y2 (en) * 1980-05-08 1986-12-15
JPS56164549U (en) * 1980-05-08 1981-12-07
JPS56164550U (en) * 1980-05-08 1981-12-07
JPS6144427Y2 (en) * 1980-05-08 1986-12-15
JPS5712743U (en) * 1980-06-23 1982-01-22
JPS6218033Y2 (en) * 1980-06-23 1987-05-09
US4397078A (en) * 1980-08-11 1983-08-09 Telmec Co., Ltd. Method and apparatus for measuring a gap distance between a mask and a wafer to be used in fabrication of semiconductor integrated circuits
JPS5847447A (en) * 1981-09-17 1983-03-19 Riken Vitamin Co Ltd Feed for fry
JPS6143977B2 (en) * 1981-09-17 1986-09-30 Riken Vitamin Co
JPS58175631U (en) * 1982-05-18 1983-11-24 株式会社東芝 parallelization device
JPH0195732A (en) * 1987-10-06 1989-04-13 Nippon Suisan Kaisha Ltd Feed for fish and shellfish
JPH0569489B2 (en) * 1987-10-06 1993-10-01 Nippon Suisan Kaisha Ltd
JP2013120789A (en) * 2011-12-06 2013-06-17 National Institute Of Advanced Industrial & Technology Exposure system

Also Published As

Publication number Publication date
JPS5616545B2 (en) 1981-04-16

Similar Documents

Publication Publication Date Title
JPS53111280A (en) Mask or wafer for production of semiconductor elements and device for aligning these
JPS5530823A (en) Mask-wafer gap setting device
JPS5211774A (en) Method of detecting relative position of patterns
JPS5357760A (en) Electron beam exposure apparatus
JPS56130738A (en) Method and device for exposure
JPS52108776A (en) Pattern sticking device
JPS53122369A (en) Automatic alignment unit for wafer
JPS55144230A (en) Exposure device
JPS53105381A (en) X-ray copying mask
JPS51118968A (en) Electron beam exposure device
JPS5375770A (en) X-ray copying mask
JPS5732629A (en) Mask aligner
JPS52143878A (en) Silicon wafer defect detector
JPS5279654A (en) Production of semiconductor device
JPS52122480A (en) Probe head for probe card
JPS547277A (en) Fine adjustment unit for stage
JPS5233205A (en) Rail alignment adjusting reference instrument
JPS5389372A (en) Production of semiconductor device
JPS6421920A (en) Close-up type exposure device
JPS53139982A (en) Exposure apparatus of semiconductor substrates
JPS545659A (en) Manufacture of semiconductor device
JPS52119214A (en) Adjusting method for load bearing spring
JPS5228354A (en) Measuring device
JPS51147180A (en) Method of manufacturing of semiconductor device
JPS5215375A (en) Adjusting method of bridge circuit