JPS55144230A - Exposure device - Google Patents

Exposure device

Info

Publication number
JPS55144230A
JPS55144230A JP5279479A JP5279479A JPS55144230A JP S55144230 A JPS55144230 A JP S55144230A JP 5279479 A JP5279479 A JP 5279479A JP 5279479 A JP5279479 A JP 5279479A JP S55144230 A JPS55144230 A JP S55144230A
Authority
JP
Japan
Prior art keywords
exposure mask
substrate
mask
holding plate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5279479A
Other languages
Japanese (ja)
Inventor
Akira Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5279479A priority Critical patent/JPS55144230A/en
Publication of JPS55144230A publication Critical patent/JPS55144230A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make possible the even and close contact of an exposure mask irrespective of the warpage and plane accuracy of a substrate by feeding high-pressure gas between the exposure mask and mask holding plate so that the exposure mask is pressure-contacted to the substrate.
CONSTITUTION: A glass substrate 2 which comprises coating a resist film on an electrode conductive film is placed and fixed on a fine adjustment base 1 which permits free adjustment within horizontal and vertical planes. An exposure mask composed of a flexible member, e.g., celluloid or the like, formed with the specified electrode patterns in opposition to the substrate 2 is disposed in proximity to the substrate, by airtightly bonding its circumferential edge part to a mask holding plate 4. The position alignment is precisely accomplished by the fine adjustment base 1. After this, high-pressure gas such as compressed air is fed between the exposure mask 8 and mask holding plate 4 through the feed hole 41 pierced in the mask holding plate 4 as shown by an arrow 5 to let the exposure mask 3 elongate, by which the exposure mask 3 may be evenly pressure-contacted onto the glass substrate 2.
COPYRIGHT: (C)1980,JPO&Japio
JP5279479A 1979-04-27 1979-04-27 Exposure device Pending JPS55144230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5279479A JPS55144230A (en) 1979-04-27 1979-04-27 Exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5279479A JPS55144230A (en) 1979-04-27 1979-04-27 Exposure device

Publications (1)

Publication Number Publication Date
JPS55144230A true JPS55144230A (en) 1980-11-11

Family

ID=12924735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5279479A Pending JPS55144230A (en) 1979-04-27 1979-04-27 Exposure device

Country Status (1)

Country Link
JP (1) JPS55144230A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420526A2 (en) * 1989-09-28 1991-04-03 AT&T Corp. Improved contact printing process
DE4141479A1 (en) * 1990-12-26 1992-07-02 Adtec Engineering Co METHOD AND DEVICE FOR PLACING A FILM MASK IN CONTACT WITH AN OBJECT
EP0953878A2 (en) * 1998-04-28 1999-11-03 Ushiodenki Kabushiki Kaisha Contact exposure process and device
CN108439328A (en) * 2018-03-12 2018-08-24 中国科学院光电技术研究所 A kind of inflating thin film method preparing flexible film substrate micro nano structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420526A2 (en) * 1989-09-28 1991-04-03 AT&T Corp. Improved contact printing process
DE4141479A1 (en) * 1990-12-26 1992-07-02 Adtec Engineering Co METHOD AND DEVICE FOR PLACING A FILM MASK IN CONTACT WITH AN OBJECT
EP0953878A2 (en) * 1998-04-28 1999-11-03 Ushiodenki Kabushiki Kaisha Contact exposure process and device
EP0953878A3 (en) * 1998-04-28 2002-06-12 Ushiodenki Kabushiki Kaisha Contact exposure process and device
CN108439328A (en) * 2018-03-12 2018-08-24 中国科学院光电技术研究所 A kind of inflating thin film method preparing flexible film substrate micro nano structure

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