JPS5527645A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5527645A JPS5527645A JP10074978A JP10074978A JPS5527645A JP S5527645 A JPS5527645 A JP S5527645A JP 10074978 A JP10074978 A JP 10074978A JP 10074978 A JP10074978 A JP 10074978A JP S5527645 A JPS5527645 A JP S5527645A
- Authority
- JP
- Japan
- Prior art keywords
- polycrystalline
- layers
- electrode
- layer
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910021332 silicide Inorganic materials 0.000 abstract 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10074978A JPS5527645A (en) | 1978-08-17 | 1978-08-17 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10074978A JPS5527645A (en) | 1978-08-17 | 1978-08-17 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5527645A true JPS5527645A (en) | 1980-02-27 |
| JPS6227547B2 JPS6227547B2 (enrdf_load_stackoverflow) | 1987-06-15 |
Family
ID=14282171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10074978A Granted JPS5527645A (en) | 1978-08-17 | 1978-08-17 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5527645A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4518981A (en) * | 1981-11-12 | 1985-05-21 | Advanced Micro Devices, Inc. | Merged platinum silicide fuse and Schottky diode and method of manufacture thereof |
| US4794445A (en) * | 1986-07-31 | 1988-12-27 | Hitachi, Ltd. | Semiconductor device |
| US5920110A (en) * | 1995-09-26 | 1999-07-06 | Lsi Logic Corporation | Antifuse device for use on a field programmable interconnect chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106174A (en) * | 1978-02-08 | 1979-08-20 | Nec Corp | Semiconductor device and its manufacture |
-
1978
- 1978-08-17 JP JP10074978A patent/JPS5527645A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106174A (en) * | 1978-02-08 | 1979-08-20 | Nec Corp | Semiconductor device and its manufacture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4518981A (en) * | 1981-11-12 | 1985-05-21 | Advanced Micro Devices, Inc. | Merged platinum silicide fuse and Schottky diode and method of manufacture thereof |
| US4794445A (en) * | 1986-07-31 | 1988-12-27 | Hitachi, Ltd. | Semiconductor device |
| US5920110A (en) * | 1995-09-26 | 1999-07-06 | Lsi Logic Corporation | Antifuse device for use on a field programmable interconnect chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6227547B2 (enrdf_load_stackoverflow) | 1987-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5563840A (en) | Semiconductor integrated device | |
| JPS52120768A (en) | Semiconductor device | |
| JPS56162864A (en) | Semiconductor device | |
| JPS5527645A (en) | Semiconductor device | |
| JPS5662345A (en) | Load frame and semiconductor device | |
| JPS551153A (en) | Semiconductor fitting device | |
| JPS5348670A (en) | Electrode structure of semiconductor element | |
| EP0304929A3 (en) | Semiconductor device having an electrode covered with a protective film | |
| JPS52154358A (en) | Production of semiconductor device | |
| JPS52129380A (en) | Semiconductor device | |
| JPS5623768A (en) | Semiconductor device | |
| JPS5521175A (en) | Semiconductor device | |
| JPS54154281A (en) | Bipolar semiconductor device and its manufacture | |
| JPS5313359A (en) | Connecting method for semiconductor element or device | |
| JPS5286782A (en) | Production of semiconductor integrated circuit | |
| JPS57180138A (en) | Semiconductor device | |
| JPS54148479A (en) | Resin-sealed semiconductor device | |
| JPS51149782A (en) | Semiconductor device | |
| JPS5264287A (en) | Group iii-v compound semiconductor element | |
| JPS5718354A (en) | Semiconductor integrated circuit | |
| JPS55111165A (en) | Semiconductor device | |
| JPS55118665A (en) | Semiconductor device | |
| JPS54140472A (en) | Semiconductor device | |
| JPS54160185A (en) | Semiconductor integrated circuit device | |
| JPS5292478A (en) | Semiconductor device and its preparation |