JPS5526690A - Manufacturing semiconductor device - Google Patents

Manufacturing semiconductor device

Info

Publication number
JPS5526690A
JPS5526690A JP10031878A JP10031878A JPS5526690A JP S5526690 A JPS5526690 A JP S5526690A JP 10031878 A JP10031878 A JP 10031878A JP 10031878 A JP10031878 A JP 10031878A JP S5526690 A JPS5526690 A JP S5526690A
Authority
JP
Japan
Prior art keywords
electrode
width
slot
etch
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10031878A
Other languages
Japanese (ja)
Inventor
Kaname Kanazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10031878A priority Critical patent/JPS5526690A/en
Publication of JPS5526690A publication Critical patent/JPS5526690A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent an erosion of an electrode metal by covering the side face of a collector electrode with a slot having the width longer than an etch cut to be etch-cut, in forming a semiconductor element having an inverse beveled construction by the etch-cutting.
CONSTITUTION: Electrodes 3, 4 and 2 for an emitter region E, base region B, and collector region C are formed in a semiconductor wafer 1. Subsequently, a wax 6 is coated onto the face wherein the electrode 3 and 4 are mounted to contact the face on a plan plate jig 7, and a slot 8 is formed by operating a dicing saw from the electrode 2 to the wafer interior 1. in this case, the width of the slot 8 is measured wider than the length obtained by an etch cut to leave an electrode 2a with a desirable width and becoms deeper than a thickness of the electrode 2a in the range that it will not reach a collector-base junction. Thereafter, the electrode 2a is covered with a wax 9 so that the etching width becomes narrower than the width of the slot 8 and is impregnated in the etching solution until it will be diveded into several pellets to establish a beveled construction.
COPYRIGHT: (C)1980,JPO&Japio
JP10031878A 1978-08-16 1978-08-16 Manufacturing semiconductor device Pending JPS5526690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10031878A JPS5526690A (en) 1978-08-16 1978-08-16 Manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10031878A JPS5526690A (en) 1978-08-16 1978-08-16 Manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5526690A true JPS5526690A (en) 1980-02-26

Family

ID=14270829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10031878A Pending JPS5526690A (en) 1978-08-16 1978-08-16 Manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5526690A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002538627A (en) * 1999-02-26 2002-11-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Multilayer diode and method for manufacturing the multilayer diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002538627A (en) * 1999-02-26 2002-11-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Multilayer diode and method for manufacturing the multilayer diode

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